Page 429 - Mechanical Engineers' Handbook (Volume 4)
P. 429

418   Cooling Electronic Equipment

                          2. M. M. Yovanovich and V. W. Antonetti, ‘‘Application of Thermal Contact Resistance Theory to
                             Electronic Packages,’’ in Advances in Thermal Modeling of Electronic Components and Systems, A.
                             Bar-Cohen and A. D. Kraus (eds.), Hemisphere, New York, 1988, pp. 79–128.
                          3. Handbook of Chemistry and Physics (CRC), Chemical Rubber Co., Cleveland, OH, 1954.
                          4. W. Elenbaas, ‘‘Heat Dissipation of Parallel Plates by Free Convection,’’ Physica 9(1), 665–671
                             (1942).
                          5. J. R. Bodoia and J. F. Osterle, ‘‘The Development of Free Convection Between Heated Vertical
                             Plates,’’ J. Heat Transfer 84, 40–44 (1964).
                          6. A. Bar-Cohen, ‘‘Fin Thickness for an Optimized Natural Convection Array of Rectangular Fins,’’ J.
                             Heat Transfer 101, 564–566.
                          7. A. Bar-Cohen and W. M. Rohsenow, ‘‘Thermally Optimum Arrays of Cards and Fins in Natural
                             Convection,’’ Trans. IEEE Chart, CHMT-6, 154–158.
                          8. E. M. Sparrow, J. E. Niethhammer, and A. Chaboki, ‘‘Heat Transfer and Pressure Drop Character-
                             istics of Arrays of Rectangular Modules Encountered in Electronic Equipment,’’ Int. J. Heat Mass
                             Transfer 25(7), 961–973 (1982).
                          9. R. A. Wirtz and P. Dykshoorn, ‘‘Heat Transfer from Arrays of Flatpacks in Channel Flow,’’ Pro-
                             ceedings of the Fourth Int. Electronic Packaging Society Conference, New York, 1984, pp. 318–326.
                          10. S. B. Godsell, R. J. Dischler, and S. M. Westbrook, ‘‘Implementing a Packaging Strategy for High
                             Performance Computers,’’ High Performance Systems, 28–31 (January 1990).
                          11. A. D. Kraus and A. Bar-Cohen, Design and Analysis of Heat Sinks, Wiley, New York, 1995.
                          12. M. Jakob, Heat Transfer, Wiley, New York, 1949.
                          13. S. Globe and D. Dropkin, ‘‘Natural Convection Heat Transfer in Liquids Confined by Two Horizontal
                             Plates and Heated from Below,’’ J. Heat Transfer, Series C 81, 24–28 (1959).
                          14. W. Mull and H. Rieher, ‘‘Der Warmeschutz von Luftschichten,’’ Gesundh-Ing. Beihefte 28 (1930).
                          15. J. G. A. DeGraaf and E. F. M. von der Held, ‘‘The Relation Between the Heat Transfer and the
                             Convection Phenomena in Enclosed Plane Air Layers,’’ Appl. Sci. Res., Sec. A 3, 393–410 (1953).
                          16. A. Bar-Cohen and W. M. Rohsenow, ‘‘Thermally Optimum Spacing of Vertical, Natural Convection
                             Cooled, Parallel Plates,’’ J. Heat Transfer 106, 116–123 (1984).
                          17. S. W. Churchhill and R. A. Usagi, ‘‘A General Expression for the Correlation of Rates of Heat
                             Transfer and Other Phenomena,’’ AIChE J. 18(6), 1121–1138 (1972).
                          18. N. Sobel, F. Landis, and W. K. Mueller, ‘‘Natural Convection Heat Transfer in Short Vertical Chan-
                             nels Including the Effect of Stagger,’’ Proceedings of the Third International Heat Transfer Confer-
                             ence, Vol. 2, Chicago, IL, 1966, pp. 121–125.
                          19. W. Aung, L. S. Fletcher, and V. Sernas, ‘‘Developing Laminar Free Convection Between Vertical
                             Flat Plates with Asymmetric Heating,’’ Int. J. Heat Mass Transfer 15, 2293–2308 (1972).
                          20. O. Miyatake, T. Fujii, M. Fujii, and H. Tanaka, ‘‘Natural Convection Heat Transfer Between Vertical
                             Parallel Plates—One Plate with a Uniform Heat Flux and the Other Thermally Insulated,’’ Heat
                             Transfer Japan Research 4, 25–33 (1973).
                          21. W. Aung, ‘‘Fully Developed Laminar Free Convection Between Vertical Flat Plates Heated Asy-
                             metrically,’’ Int. J. Heat Mass Transfer 15, 1577–1580 (1972).
                          22. W. H. McAdams, Heat Transmission, 3rd ed., McGraw-Hill, New York, 1954.
                                                           ¨
                          23. R. Hilpert, Warmeabgue von Geheizten Drahten and Rohren in Lufstrom, Forsch, Ing-Wes 4, 215–
                             224 (1933).
                          24. S. Whitaker, ‘‘Forced Convection Heat Transfer Correlations for Flow in Pipes, Past Flat Plates,
                             Single Cylinders, Single Spheres and for Flow in Packed Beds and Tube Bundles,’’ AIChE Journal
                             18, 361–371 (1972).
                          25. F. Kreith, Principles of Heat Transfer, International Textbook Co., Scranton, PA, 1959.
                          26. A. P. Colburn, ‘‘A Method of Correlating Forced Convection Heat Transfer Data and a Comparison
                             of Fluid Friction,’’ Trans AIChE 29, 174–210 (1933).
                          27. ‘‘Standards of the Tubular Exchanger Manufacturer’s Association,’’ New York, 1949.
                          28. W. Drexel, ‘‘Convection Cooling,’’ Sperry Engineering Review 14, 25–30 (December 1961).
                          29. W. Robinson and C. D. Jones, The Design of Arrangements of Prismatic Components for Crossflow
                             Forced Air Cooling, Ohio State University Research Foundation Report No. 47, Columbus, OH,
                             1955.
   424   425   426   427   428   429   430   431   432   433   434