Page 178 - Mechatronic Systems Modelling and Simulation with HDLs
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8.2 DEMONSTRATOR 5: CAPACITIVE PRESSURE SENSOR 167
Figure 8.2 Chip photo of the integrated, capacitive pressure sensor system in surface microme-
chanics (Reproduced by Permission of Gerhard-Mercator-University, Duisburg, Germany)
(a)
(b)
Figure 8.3 SEM photo of the cross-section of a pressure element (Reproduced by Permission
of Fraunhofer-Institute IMS, Duisburg, Germany)
parallel. This array of eighteen active and eighteen passivated pressure elements,
is duplicated in order to achieve still higher precision using differential path tech-
nology. For each set of eighteen pressure elements, a concentrated component is
used, the capacitance of which is correspondingly multiplied.
