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Ch80-I044963.fm  Page 397  Tuesday, August 1, 2006  4:54 PM
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                  plastic  after  a  few  usage  times  the joints  will  get  broken.  Therefore,  spiral  connections  were  tested
                  instead  of  knotting.  However,  the  problem  still  partly  remained  and  we  concluded  that  the  edges  of
                  heat-shrinkable  plastic could be too hard  for fibres, which  gradually  abraded  off  and disconnected  the
                  sensor  from  the  system.  We  tested  also  small  PWBs  as  combiners  along  the  sensor  connection  bus.
                  Yarns  were  soldered  directly  to these PWBs.  In this  case the  same problem  existed  and the  yarn  got
                  broken  near  the  PWB's  edge.  The  reason  could  be  too  hard  PWB's  edges  or  the  interface  between
                  solder and yarns.
                  We have  also  sewn metal  clad aramid  fibre  yarns  by hand to  cloth to  form  electrodes (Rantanen  at  al
                  2001).  These  kinds  of  electrodes  were  used  to  replace  commercial  electrodes  in the  measurement  of
                  skin resistance  in the sensor shirt. The main function  of this measurement was to indicate the  sweating
                  level  of the  user.  The  simple  measurement  was not  very  demanding  for  the  electrodes  and they  were
                  found  to  be  sensitive  enough  for  our purposes.  However,  it would  be beneficial  to be  able to  sew the
                  yarn  by machine to ensure  larger electrical  conductivity  and to ease  and accelerate the  implementation
                  of electrodes.  In the bioimpedance  measurement  suit we have also tested  fabric  electrodes  (Vuorela et
                  al.  2003).  Suit's  purpose  is  to  measure  the  impedance  of  the  user  and  based  on  that  the  suit  can
                  indicate  the  total  body  water  level.  In  this  application  our  goal  was  to  replace  commercial  silver
                  chloride  electrodes  with  fibre  electrodes,  since  commercial  electrodes  were  found  unsuitable  for
                  moving  people.  At  this  time  we  have  utilised  polyamide  based  silver  plated  material  (Finnesd  data
                  sheet). New  electrodes  were  found  to  be  better  than  commercial  ones however,  long-term  durability,
                  e.g. coping with continuous washings  and abrasion  has to be found  out.


                  TEST METHODS AND RESULTS

                  Due to problems  that  have  been  occurring  in ECF's  connections  we  decided  to  find  out  whether  we
                  could improve the reliability of these connections by proper connection mechanisms and materials. We
                  have  studied the use  of two kinds  of silver  clad  aramid fibre yarns. The first yam  is thinner  and more
                  twisted  than the other one. For a reference  material  we chose another  easily  available material  made of
                  stainless  steel, which  is also very strength  (Bekaert  data sheet). Unfortunately,  it has  poor  conductivity
                  and  its joining to PWBs  is difficult,  because its melting point  is much higher than  in joining materials.
                  For  metal  clad  aramid  fibre  yarn  connections  we  used  SnPb  (tin-lead)  solder  and  for  stainless  steel
                  yarn  connections  we  used  Sn  (tin)  solder.  Lead  will  be  forbidden  in  consumer  electronics  and
                  therefore,  we  also  made joints  by  using  electrically  conductive  adhesives.  At  first  we  used  Loctite's
                  conductive  adhesive  (Loctite data sheet)  and later we used  also Electron  Microscopy  Sciences'  (EMS)
                  adhesive (EMS data sheet). Both adhesives were isotropic  and silver filled and they had to be cured by
                  heat.  Their  conductivity  properties  are  almost  similar,  but  thermal  properties  of EMS's  adhesive  are
                  better.

                  For  test  methods  we  chose  accelerated  environment  reliability  tests  and  a  tensile  strength  test.
                  Accelerated  environmental  tests  produce  failures  in  joints  by  the  same  damage  mechanisms  than  in
                  real  use  but  in  noticeably  shorter  time.  Therefore,  these  tests  can  be  utilised  to  estimate  long-term
                  behavior  of  the  electronics  products.  The  most  probable  environment  hazards  causing  damages  are
                  temperature  and  humidity  (Yoshinori  &  Yasuko  1996)  and  therefore,  we  decided  to  include  these
                  parameters  to  our tests.  We  performed  tests  in  specific  test  chambers  in  our  institute  and  during  the
                  tests temperature and humidity inside the chambers varied.

                  Ten pieces  of  one-type  connections  have  been tested  to  ensure  the  reliability  of the results.  We  have
                  tested  SnPb  and  Sn  solders  and  two  kinds  of  isotropic  adhesives  as joining  materials,  surface  mount
                  and  leading through techniques,  and  also rubber  sealant  on  some joints to prevent  abrasion  of the yarn
                  against hard  solder connection. Each  channel  of the climate chamber  measures continually the voltage
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