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10    1 From Optical MEMS to Micromechanical Photonics
                            absorption rate is proportional to the square of the incident light intensity, a
                            3-D structure is fabricated by scanningthe focused spot of a near-infrared-
                            wavelength beam in three dimensions inside the resin. The lateral and depth
                            resolutions are said to 0.62 and 2.2 µm, respectively. After that, they also
                            succeeded in fabricatinga micrometer sized cow with a resolution of 140 nm
                            [1.30].

                            Replication

                            Replication from a mold is important technology for realizing lower cost and
                            mass production. For optical MEMS applications, the use of sol–gels which
                            become glass-like material upon curing is foreseen. ORMOCER US-S4 is such
                            a material. It is optically transparent over the wavelength from 400 to 1600 nm
                            and has a refractive index of 1.52 at 588 nm. Obi et al. replicated many sol–gel
                            micro-optical devices and optical MEMS includinga sol–gel cantilever with a
                            microlens on the top [1.31].

                            1.2.3 Monolithic Integration – Micromachining for an LD

                            Monolithic integration of micromechanics is possible not only on a Si sub-
                            strate but also on a semiconductor LD substrate of GaAs [1.14] or InP [1.15].
                            A smooth etched surface and a deep vertical sidewall are necessary for good
                            lasingcharacteristics of LDs.
                               For fabricatinga resonant microcantilever (MC), for example, there are
                            three micromachiningsteps (Fig. 1.11). (a) An etch-stop layer of AlGaAs
                            is formed in an LD structure prepared by metalorganic vapor phase epi-
                            taxy (MOVPE). (b) The microstructure shape is precisely defined by a re-
                            active dry-etchingtechnique, which simultaneously forms the vertical etched

                                (a)                            (c)
                                                                AlGaAs etch-  Resist mask
                                               GaAs (cap)       stop layer
                                               AlGaAs (clad)
                                               Active layer   GaAs sacrificial
                                               AlGaAs (clad)      part
                                               GaAs
                                               AlGaAs (etch-stop layer)         GaAs substrate
                                     GaAs substrate
                                (b)      Cl  beam             (d)
                                          2
                                                                                     Laser diode
                                                   Resist mask     Microcantilever   (LD)
                              Microcantilever  Etched mirror       (MC)
                              (MC)

                                              GaAs substrate
                                                                          GaAs substrate
                            Fig. 1.11. Steps in the fabrication of a GaAs/AlGaAs resonant microcantilever
                            (MC)integrated with a laser diode (LD)
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