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2.4 Applications  57
                                LD2          LD1             Laser diode (LD2)  Hole for wet-etching





                                                             Microcantilever (MC)





                                   MC

                                                                 Laser diode (LD1)
                            Fig. 2.30. Photograph of a resonant sensor deposited with chemically inductive
                            material phthalocyanine of 1 µm thickness



                               (a)                            (b)




                                                f =288.4 kHz                   f 0 =287.9 kHz
                                                 0




                            Fig. 2.31. Resonant frequency change of 500 Hz from 288.4 to 287.9 kHz, due to
                            the mass increase of 54 ng for the 1-µm thick phthalocyanine deposition


                            increased by shorteningthe cantilever length. A resonant frequency of 10 MHz
                            is applicable with a length of less than 20 µm(3 µmthick).
                               Possible applications are resonant frequency change detection type ac-
                            celerometers and gas sensors. Chemically inductive material phthalocyanine
                            was deposited of 1 µm thickness on the resonator as shown in Fig. 2.30. Then
                            the resonant frequency was changed by 500 Hz from 288.4 to 287.9 kHz due
                            to the mass increase of 54 ngcorrespondingto the 1-µm thick phthalocya-
                            nine deposition. It was confirmed that the resonant sensitivity is very high
                            (Fig. 2.31). Both figures show the possibility of detecting a gas.
                               The yield strength of single crystalline GaAs is less than that of Si, but it
                            is five times greater than that of steel. Furthermore, micromachining can be
                            used to fabricate microstructures of high purity with a low defect density and
                            no residual stress. These mechanical properties mean that GaAs-based and
                            InP-based microstructures are suitable for use in integrated micromechanical
                            photonics systems.
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