Page 269 - A Practical Guide from Design Planning to Manufacturing
P. 269

Layout  241


                             Length


                                            N+
                                          diffusion         Length
                        Poly
                        gate
         Width
                                                             Poly
                                                   Width  S S S S Source e e e  Drain
                                                             gate
           Source                  Drain
                                                                     N+
                       P-well                     P-well           Diffusion
                Transistor cross section               Transistor layout
         Figure 8-1 Transistor layout.



        The well will determine the type of dopant in between the source and
        drain. For an NMOS device, the well will use P-type dopant, and for a
        PMOS, the well will be N-type dopant. The layout marks the boundaries
        of each well region so that during manufacturing each region will be
        implanted with the correct type of dopant. Inside the well, an area of
        diffusion meant for heavy doping is drawn. These regions are often
        labeled “N+” or “P+” to indicate heavier doping than the well. To make
        transistor source and drain regions, this diffusion is the opposite type
        as the well, N-type for NMOS devices and P-type for PMOS devices.
          The poly gate layer completes the transistor. A poly wire is drawn
        across the diffusion region. The diffusion on one side of the poly wire will
        form the source of the transistor and the other side will be the drain. In
        manufacturing, the poly layer is deposited after the well implant but
        before the heavy diffusion implant that creates the source and drain
        regions. The poly gate blocks the diffusion implant from reaching the
        silicon directly below it, and this silicon stays the same type as the orig-
        inal well. This creates the transistor channel. The source and drain
        regions on either side of the poly gate are now separated by a narrow
        strip of silicon with the opposite type of dopant. The width of the poly
        gate line determines the separation between the source and the drain,
        which is the transistor length. The width of the diffusion region deter-
        mines the width of the transistor. Increasing this width provides a wider
        path for current to flow from the source to the drain. However, this also
        consumes more area, power, and will slow signals driving the gate of this
        transistor. Anywhere a poly line crosses a diffusion region a transistor
        will be created. After the layout for the transistors is complete, the
        interconnecting wires are added.
   264   265   266   267   268   269   270   271   272   273   274