Page 293 - A Practical Guide from Design Planning to Manufacturing

Chapter
9

Semiconductor Manufacturing

Overview
This chapter shows how layout is used to create integrated circuits. The
chapter describes the manufacture of wafers and the processing steps of
depositing, patterning, and etching different layers of material to create
an integrated circuit. An example CMOS process flow is described show-
ing chip cross sections and equivalent layout at each step.

Objectives
Upon completion of this chapter the reader will be able to:

1. Describe the different types of silicon wafers in common use.
2. Understand the advantages and disadvantages of different types of
deposition.
3. Compare and contrast different types of etching.
4. Understand the creation of masks from layout and their use in
photolithography.
5. Visualize the interaction of exposure wavelength, feature size, and masks.
6. Describe the use of ion implantation in integrated circuit fabrication.
7. Explain the steps of a generic CMOS manufacturing flow.
8. Understand how sidewalls and silicide are used in MOSFET formation.

Introduction

All the semiconductor design steps discussed in previous chapters are
based upon simulations. This chapter shows how after all these steps

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