Page 197 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim
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INTRODUCTION      177


     thus  simply
                >r=oo
                                                                 2          2 2
          P  =  (   I( x,y,  0)2nr  dr with  I(x,  y, 0) =  7(0, 0, 0) exp(–2r /Wo)  (2r-w 0 >
               Jr=0
     where  r  is  the radial  distance  and  r 2  is  given  by x 2  +  y 2  according  to  the  Pythagoras
     theorem  and  w 0  is defined as the half-width of the  Gaussian  beam.  Because  the  power of
     the  laser  beam  is  normally  known,  we  can  integrate  Equation  (7.3)  to  find  that I (0,0,0)
                    2
     is  equal  to 2P/(w 0 ).  Substituting  this result  back  into  Equations  (7.2) and  (7.3)  allows
     us  to  define  the  irradiance  at  an  arbitrary  point inside  the  resin  as

                                                  2
                                               2
                                     2
                     I(x,  y, z) = (2P/w 0 )exp(–2r /w 0 )exp(– z/d p)     (7.4)
       To  derive  the  working  curve  of  the  SL  process,  the  energy  per  unit  area  in  the  beam
     must  be  determined  and  is defined as
                                  /=
                                      I(x,  y,  z) dt  where  dt  =  dx/u s  (7.5)
                                / ..  =- =-00
     where  v s  is  the  scanning  speed  along  the  x-axis.  The  energy  along  the  x-axis  is  thus
     given  by
                                                  2
                                               2
                      E(y,  z) = J-—   exp (-2y /w 0 ) exp (-z/d p)          (7.6)
                               V    w 0u S
        The maximum curing depth  is  obtained  at  the point when y  =  0; the  exposure  at this
     point is taken as the critical exposure  E c;  thus, we obtain the working curve equation for
     curing  depth  C d


                   C d = d p In (E max/E c)  and E max = E(0, 0) = J-  —    (7.7)
                                                             W 0 v s
     The  maximum  cured  line-width  l w  (2y max)  is  obtained  at  the  point  of  z  =  0,  and  is
     written  as
                                  =  w 0 2 I n ( E m a x / E c )           (7.8)
                                l w
     It is assumed here that the laser exposure  at the point with maximum depth is equal to that
     at  the  point  with maximum line- width  and  is  taken  as  critical  exposure  E c.  It  is known
     that  the  exposure  level  at  which  the  gel  point  (i.e.  polymerisation)  is  reached  should be
     slightly  higher  than the  threshold  exposure known as  the  critical exposure.
       The  relationship  between  the  curing  depth  and  line-width  is  finally  obtained  and  is
     given  by

                                  l w  =  2w 0  c d/2d p                   (7.9.)
     It is essential that the precise working curves of the curing depth and line-width  are known
     in  an  SL  process.  More  sophisticated  models  that  take  account  of  other  factors,  such  as
     dark polymerisation, diffusion of the light  source,  with calibration performed  for each SL
     system,  and photocurable  material  may be constructed.
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