Page 192 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim
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172 SILICON MICROMACHINING: SURFACE
6.8 SURFACE VERSUS BULK MICROMACHINING
In this chapter and the previous one, we have described the use of bulk and surface
micromachining to fabricate microsensors and MEMS devices. Table 6.1 summarises
the relative advantages and disadvantages of these two technologies. Perhaps the most
attractive feature is whether the technique may be readily combined with a standard 1C
process - ideally as simple pre- or postprocessing steps. In this respect, a front side surface
micromachining is perhaps the most attractive current option. However, the possibility
of a front side bulk etch of a silicon-on-insulator (SOI) CMOS device may become a
cost-effective and desirable option in the near future. The use of a micromachined SOI
membrane to make a smart gas sensor is discussed later (Section 15.2).
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