Page 192 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim
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172    SILICON MICROMACHINING:  SURFACE

      6.8  SURFACE    VERSUS    BULK     MICROMACHINING

      In  this  chapter  and  the  previous  one,  we  have  described  the  use  of  bulk  and  surface
      micromachining  to  fabricate  microsensors  and  MEMS  devices.  Table 6.1  summarises
      the  relative  advantages  and  disadvantages  of  these  two  technologies.  Perhaps  the  most
      attractive  feature  is  whether  the  technique  may  be  readily  combined  with  a  standard 1C
      process -  ideally as simple pre-  or postprocessing steps. In this respect, a front  side surface
      micromachining  is  perhaps  the  most  attractive  current  option.  However,  the  possibility
      of  a  front  side  bulk  etch  of  a  silicon-on-insulator  (SOI)  CMOS  device  may  become  a
      cost-effective  and  desirable  option  in  the  near  future.  The  use  of  a  micromachined  SOI
      membrane to  make  a smart  gas  sensor  is discussed  later  (Section  15.2).



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