Page 453 - Book Hosokawa Nanoparticle Technology Handbook

1 DISPERSION OF FINE SILICA PARTICLES APPLICATIONS

O O O
O C H
C OH
N CH N C
H C 2
2
O
HO CH C O
O n O CH 2
CH
2 HC OH
CH
O OMe 2
OMe O
MeO Si O Si OMe
MeO Si O Si OMe
OMe OMe OMe OMe
l m
Polyamide-imide
Silica particle

Figure 1.7
Chemical structure of silane-denatured amideimide.

7. Imide useful for electroless plating: hybrid of the
imide system

The imide film is used as a heat-resistant and insula-
tion material in various fields but is insufficiently
adhesive onto electroconductive materials such as
metal. However, when amic acid with alkoxysilane-
oligomer is hardened to imide on metal film, a printed
board with dispersed nanosized silica as seen in
Figs. 1–8 can be obtained. It has recently been applied
for industrial use as a double-layer flexible circuit
board with high adhesiveness.
In imide–silica hybrid film, the silica is located as a
Silica particle size: crosslinker between imide chains and realizes wet
Approximately 5nm plating with simple preprocessing without the rough-
40nm ening procedure (Fig. 1.9) [11]. By this wet plating
method, layered products with a flat interface between
Figure 1.8 the plastic film and the metal can be obtained, which
TEM picture of imide–silica hybrid. is a useful technology for meeting the requirements

Ni nonelectrolytic plating
Composelane ® Η800 Cu electrolytic plating

Figure 1.9
Imide–silica hybrid film after plating.

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