Page 435 - Organic Electronics in Sensors and Biotechnology
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412    Inde x

               FGMs (functionally graded materials),   H H
                   375                       H S (see hydrogen sulfide)
                                               2
               field-dependent mobility model, 14–20  heme oxygenase enzymes, 52
               field-effect mobility         heterojunction OPV devices,
                 and channel length, 16–17       202–208
                 for OTFTs, 58, 95           highest occupied molecular orbital
                 temperature dependence of, 15   (HOMO), 4, 5
               field-effect transistors (FETs)  hot embossing process, 276
                 with chemically sensing gates, 26  humidity sensors, 110
                 MIS structure of, 120–123   hydrazine sensors, 183
               films, 363 (See also thick films; thin films)  hydrogen sulfide (H S), 51, 54, 55
               flash memory, 311                            2
               flexible substrates, 245, 246, 248
               flocculation by particle accumulation   I I
                   (EPD), 367                ideal MIS structure, 120
               fluorescence measurements, 282  IGFETs (insulated gate FETs), 26–27
               fluorescence resonance energy transfer   immunoassays, 254–255
                   (FRET), 336               impact ionization coefficients, 197
               fluorescence-based detection, 256–257  impedance, 118
               foodborne pathogen sensors, 181–182  impedance spectroscopy, 117–127
               Förster resonance energy transfer, 269  basics of, 117–120
               Fowler-Nordheim tunneling, 23–24  charge-time behavior of capacitive
               Frenkel-Poole relationship, 18–20  multilayers, 123–127
               FRET (fluorescence resonance energy   IS of organic MIS structures, 120–123
                   transfer), 336            impedance spectrum (IS), 117
               “front detection” mode (OLEDs), 167–169  and constant phase elements,
               Full Width at Half Maximum         118–120
                   (FWHM), 79                  of different ECs, 117
               functional organic materials, 300–311  of organic MIS structures, 120–123
                 DNA, 306–309                imprinting plastics, 276–277
                 electroactive polymers, 309–311  indium tin oxide (ITO), 208, 381, 385
                 organic semiconductors, 300–306  infrared sensors, 128, 129
               functionally graded materials (FGMs),   inkjet technique, 363
                   375                       inorganic materials, for EPD,
               FWHM (Full Width at Half          374–376
                   Maximum), 79              inorganic substance monitoring
                                               anthracene-based OTFTs, 59–75
                     G G                       gold nanoparticle-modified FET
               gain, 241–243                      sensors for, 75–85
               gait analysis, 114, 115         OTFTs for, 51–55
               gas sensing measurements, 71–75  input noise current, 229
               gate dielectrics, 309, 314–315  input noise voltage, 229
               gate field-induced sensitivity   insulated gate FETs (IGFETs), 26–27
                   enhancement, 59           integrated light sources, 255–256
               gate voltage, 94              integrated optical sensor systems,
               gate-induced charges, 5           280–293
               GIXRD analysis, 69–71           organic lasers in, 286–293
               glucose sensing, 177–181        sensing schemes for, 280–286
               gold nanoparticle-modified FET   integrated pyroelectric sensors,
                   sensors (Au-NPs), 75–85       128–163
               grain boundaries                pyroelectric polymer materials,
                 disorder at, 5                   131–135
                 and scale of devices, 29–30   pyroelectricity, 130–131
                 and scaling behavior of sensing   pyroelectrics and ferroelectrics,
                    response, 35–40               129–130
                 trapping at, 27–29            sensor part, described, 135–163
               guest-host material, 269        transistor part, described, 153–163
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