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MICROLITHOGRAPHY

9.26 WAFER PROCESSING

Optical proximity correction (OPC) Off-axis illumination (OAI)
Lens
Mask

Profile Profile
1000 1000
Y position (nm) −100 Y position (nm) −100 Wafer Conventional Annular Quadrupole
780
780
560
560
340
340
120
120
−320
−320
−540
−760
−760 −540
Phase shifting mask (PSM)
Quartz
Phase
shifted
space
FIGURE 9.16 Examples of several types of resolution enhancement technologies (RETs).

FURTHER READING

Rai-Choudhury, P. (ed.), Handbook of Microlithography, Micromaching, and Microfabrication, Vol. 1:
Microlithography, Bellingham, WA: SPIE Press, 1997, pp. 597–680.
Sheats, J. R., and B. W., Smith (eds.), Microlithography Science and Technology, New York: Marcel Dekker, 1998,
pp. 109–70.
Dammel, R., “Diazonaphthoquinone-based Resists,” SPIE Tutorial Texts, Vol. TT 11, Bellingham, WA: SPIE, 1993.

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