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Determining the Manufacturing Yield and Test Strategy
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                        portunities are the characteristics that are inspected or tested. DPU
                        is traditionally based on the opportunities of defects provided in one
                        unit.
                         Defects can be attributes of units, as defined by a time or region.
                        Units can be incoming materials, individual designs, transistors in an
                        IC, repetitive manufacturing processes such as welds in a joint, etc.
                        They  can  be  individual  units  in  a  product,  such  as  printed  circuit
                        boards (PCBs), or a single product. Defects represent the total defects
                        found  on  that  unit,  expressed  as  a  number  called  defects  per  unit
                        (DPU). Since six sigma quality implies a very low DPU of 3.4 parts in
                        a  million  operations,  this  definition  has  been  converted  to  units  of
                        parts per million (PPM) in order to make it easier to communicate six
                        sigma quality requirements. The following are the equations used to
                        describe these units and their relationships:
                                        number of defects found anywhere
                                 DPU =                                        (4.1)
                                            number of units processed
                                  DPU (PPM) = DPU (fractional) · 1,000,000    (4.2)
                         DPU (PPM) is the normalization of the DPU by a factor of 1,000,000
                        in order to facilitate equating a lower number with lower defects and
                        driving it down to zero. Sometimes it is shortened to just PPM.
                         The definition of units is sometimes confusing. A unit could be a
                        single transistor on an IC chip containing a million transistors. A unit
                        could also be the IC itself, or it could the PCB containing many ICs, or
                        the product containing many PCBs. In addition, the manufacturing
                        steps needed to produce the transistors up to the final product have
                        their own defect rate. Clearly, a uniform approach to these situations
                        needs to be taken.
                         A historical approach to this dilemma has been to declare that six
                        sigma or Cpk targets have to be achieved in “everything that we do.”
                        That means every material part or manufacturing operation has a six
                        sigma goal. The collective aggregation of six sigma parts or operations
                        will also have to be equal to six sigma. This approach would logically
                        lead to the following strategy:
                          Divide the manufacturing process into the smallest defined opera-
                          tions, each with its own DPU.
                          Each manufacturing operation or material part represents a dis-
                          tinct transformation of product or material.
                          In order for the next level of part aggregation (assembly or fabri-
                          cation)  to  achieve  six  sigma  quality  without  test,  the  individual
                          DPUs  have  to  be  much  greater  in  quality  than  the  aggregation
                          output.
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