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Determining the Manufacturing Yield and Test Strategy
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                        cause many termination defects, as discussed earlier. In this method-
                        ology, it would be counted as one placement defect and zero termina-
                        tion defects for the PCB. The number of opportunities for components
                        include  all  of  the  components  plus  the  fabricated  (raw)  PCB.  The
                        number of termination is the actual number of solder joints on the
                        PCB. Some the definitions are as follows:
                                                 number of defects
                                DPMO operation =
                                              number of opportunities
                                                  operation defects  · 10 6   (4.9)
                                 DPMO index =                     · 10 6     (4.10)
                                                opportunities defects
                                          defects 1          defects 2     	
   6
                        OMI =  1 –  1 –             · 1 –              ·...  ·10
                                       opportunities 1    opportunities 2
                                                                             (4.11)
                         The DPMO for each operation is equivalent to DPU (PPM) defined
                        earlier in this chapter. The DPMO index is a useful tool for calculat-
                        ing the actual yield of the PCB, since it is based on the total number
                        of defects divided by the total number of opportunities. It is usually
                        dominated by the termination count. The DPMO index is the basis for
                        DPMO charts, discussed in the next section.
                         The overall manufacturing index (OMI) is an attempt to equalize
                        the weight of all three basic operations in PCB assembly. The yield of
                        each operation is calculated using the power expansion formula 4.8,
                        then the yields are multiplied together to form a multiplier yield for
                        the assembly line. A multiplier defect rate for the assembly line is de-
                        rived from the one-multiplier yield, and then multiplied by 1 million
                        to obtain the OMI index.
                         The  OMI  index  represents  an  overall  theoretical  defect  rate  in
                        which each operation is given equal weight, based on the its own cal-
                        culated yield. The OMI index is independent of the number of oppor-
                        tunities of each operation, and therefore can be used to compare the
                        quality of alternate PCB assembly lines.
                        4.3.4  DPMO charts
                        DPMO charts are attribute charts used to monitor the quality of PCB
                        assembly lines. They are best used instead of attribute defect charts
                        such as U or C charts. Each type of PCB can be charted every time it
                        is run through the assembly line. A multiplication factor (MF) is pro-
                        vided in the calculations to make the conversion to million opportuni-
                        ties. DPMO charts can be used with defects codes for quality tracking
                        and continuous improvements.
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