Page 89 - Six Sigma for electronics design and manufacturing
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Six Sigma for Electronics Design and Manufacturing
                     58
                     fications, since it is assumed that in specifying the bond, only a mini-
                     mum value is given. For solder defects, a composite specification can
                     be assumed to be two-sided, since solder defects can be one- or two-
                     sided,  as  in  excessive  or  insufficient  solder.  The  difference  between
                     implied one- or two-sided specifications is that the number of defects
                     representing the f(z) value under the normal curve should be halved
                     for  two-sided  specifications,  or  used  directly  for  one-sided  specifica-
                     tions, resulting in different implied Cpk interpretations. The decision
                     for one- or two-sided specifications for implied Cpk should be left to
                     the appropriate design and manufacturing engineers.
                       An example of an attribute process calculation to generate an im-
                     plied Cpk is for solder defects. They are usually measured in PPM or
                     parts per million of defects obtained in production divided by the total
                     number of solder joints in the product (total number of opportunities
                     for solder defects). Solder defects may result from the combination of
                     several  specifications  of  design  parameters  such  as  component  pad
                     size, drill hole size, fabrication quality of plated metal surface, and
                     the material and process parameters of the soldering equipment. A
                     100  PPM  solder  process  (1  solder  defect  in  10,000  terminations  or
                     joints) is calculated to have a Cpk = 1.3 as follows:
                     1. 100 PPM defects (assuming a two-sided specification), 50 PPM per
                        each tail of the normal curve
                     2. 50 PPM is f(z) = 0.00005 or z = 3.89, from standard normal curve
                        tables.
                     3. Implied Cpk = z/3 = 1.3
                       The assumptions are that the defects can occur on either side of the
                     implied  specifications,  the  process  is  normally  distributed,  and  the
                     process average is equal to the specification nominal. If this example
                     of Cpk was for a wire bond machine, then it could be assumed that the
                     defects occur due to one side of the specification limits of minimum
                     pull strength. In this case, the Cpk can be calculated as follows:
                     1. 100 PPM defects (assuming a one-sided specification) is 100 PPM
                        per one tail of the normal curve
                     2. 100 PPM is f(z) = 0.0001 or z = 3.72, from standard normal curve
                        tables
                     3. Implied  Cpk  =  z/3  =  1.24,  which  is  lower  quality  than  two-sided
                        defects
                       It can be seen that the method of implied Cpk could lead to various
                     interpretations of one- versus two-sided specifications when the Cpk
                     methodology is used. If the six sigma interpretation of quality is used,
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