Page 333 - The Handbook for Quality Management a Complete Guide to Operational Excellence
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A n a l y z e S t a g e 321
No solder in hole
Components Size ratio Hole/lead
Solderability Lead cut & clinch installation Location
Contaminated Ground plant Shape Design
Assembly Plug installation Tape application Weight distribution Board Heat sink Plug shape Mount location
Storage Handling selection Masks Mask
Board contamination
Hole/pad
Board
Head uneven Inconsistent Flux Head low Replacement interval not active Keyway orientation direction across wave Misregistration Plating Drill smear
Pre-heat Temp. varying Temp. high Contaminated Excessive blow off Board float over wave Oxidized Warped Fabrication Process production class cause-and-effect diagram.
Process Height low High Inconsistent Circuitry too close to lip Location in multi stage fixture Board Contaminated
Baffle condition Solder contam. Excessive adjustment Wave uneven Conveyor speed Fixture
Solder wave
Figure 15.3
320
15_Pyzdek_Ch15_p305-334.indd 320 11/20/12 10:33 PM
