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W ir e Bond Testing 127

4-11 Harman, G. G., “The Microelectronic Ball-Bond Shear Test - A Critical Review
and Comprehensive Guide to Its Use,” The Int. J. Hybrid Microelectronics, 6, 1983,
pp. 127–141. Also pub. in Solid State Tech.,Vol. 27, May 1984, pp. 186–196.
4-12 Stafford, J. W., “Reliability Implications of Destructive Gold-Wire Bond Pull
and Ball Bond Shear Testing,” Semiconductor International,Vol. 5, May 1982,
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4-13 Arleth, J. A. and Demenus, R. D., “A New Test for Thermocompression
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4-14 Gill, W. and Workman, W., “Reliability Screening Procedures for Integrated
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4-15 Jellison, J. L., “Effect of Surface Contamination on the Thermocompression
Bondability of Gold,” Proc. 28th IEEE Electronic Components Conference,
Washington, D.C., May 11–12, 1975, pp. 271–277; also IEEE Trans. on Parts,
Hybrids, and Packaging Vol. 11, 1975, pp. 206–211.
4-16 Jellison, J. L., “Kinetics of Thermocompression Bonding to Organic
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Hybrids, and Packaging Vol. 13, 1977, pp. 132–137.
4-17 Shimada, W., Kondo, T., Sakane, H., Banjo, T., and Nakagawa, K., “Thermo-
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4-18 Thompson, R. J., Cropper, D. R., and Whitaker, B. W., “Bondability Problems
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4-19 Panousis, N. T. and Fischer, M. K. W., “Non-Destructive Shear Testing of Ball
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4-20 Charles, H., Johns Hopkins University, Applied Physics Laboratory, private
communication.
4-21 Jellison, J. L. and Wagner, J. A., “The Role of Surface Contaminants in the
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Electronics Components Conference, Cherry Hill, New Jersey, May 14–16, 1979,
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4-22 St. Pierre, R. L. and Reimer, D. E., “The Dirty Thick Film Conductor and Its
Effect On Bondability,” Proc. 25th IEEE ECC, 1976, pp. 98–102.
4-23 Johnson, K. I., Scott, M. H., and Edson, D. A., “Ultrasonic Wire Welding, Part
II, Ball-Wedge Wire Welding,” Solid State Technology Vol. 20, 1977, pp. 91–95.
4-24 Schultz, G. and Chan, K., “A Quantative Evaluation of Compound Ball
Bonds,” Proc. Intl. Symposium on Microelectronics (ISHM), Seattle, Washington,
Oct. 12–19, 1988, pp. 238–245. Also, for the use of stacked bumps for flip chip
see: Suwa, M., Takahashi, H., Kamada, C. and Nishiuma, M.,” Development
of a New Flip-Chip Bonding Process using Multi-Stacked µ-Au Bumps,” Proc.
44th Electronic Components and Technology Conference, Washington, D.C., May
1–4, 1994, pp. 906–909.
4-25 Ramsey, T., Alfaro, C., and Dowell, H., “Metallurgy’s Part in Gold Ball
Bonding,” Semicon. Intl., Vol. 14, no. 5, Apr. 1991, pp. 98–102.
4-26 Data abstracted and summarized from SEMATECH machine benchmarking
studies, Used with permission.
4-27 Jaecklin, V. P., “Room Temperature Ball Bonding Using High Ultrasonic Frequencies,”
Proc. Semicon Test, Assembly & Packaging, May 2–4, 1995, pp. 208–214.
4-28 Leonhardt, D. A., “Ultrafine Pitch Gold Ball Bonding,” Semiconductor
International, Vol. 19, July 1996, pp. 311–318.
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4-30 Kashiwabara, M. and Hattori, S., “Formation of Al-Au Intermetallic Compounds
and Resistance Increase for Ultrasonic Al Wire Bonding,” Review of the Electrical
Communication Laboratory (NTT), Vol. 17, Sept. 1969, pp. 1001–1013.