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4-31 Clatterbaugh, G. V., Weiner, J. A., and Charles, H. K., Jr., “Gold-Aluminum
Intermetallics: Ball Bond Shear Testing and Thin Film Reaction Couples,”
IEEE Trans. on Components, Hybrids, and Manufacturing Technology Vol. 7, 1984,
pp. 349–356. Also see earlier publications by Charles and Clatterbaugh, Int. J.
Hybrid Microelectronics, Vol. 6, 1983, pp. 171–186.
4-32 Devaney, J. R. and Devaney, R. M., “Thermosonic Ball Bond Evaluation by a
Bond Pluck Test,” Proceedings ISTFA Conference, Los Angeles, California, 1984,
pp. 237–242.
4-33 White, M. L., Serpiello, J. W., Stringy, K. M., and Rosenzweig, W., “The Use
of Silicone RTV Rubber for Alpha Particle Protection on Silicon Integrated
Circuits,” 19th Annual Proc., Reliability Physics , Orlando, Florida, Apr. 7–9,
1981, pp. 43–47.
4-34 Michaels, D., Burroughs Corp. (UNISYS), comments made at ASTM Committee
F-1 Meeting, San Diego, California, Feb. 1–2, 1983.
4-35 Weiner, J. A., Clatterbaugh, G. V., Charles, H. K., Jr., and Romenesko, B. M.,
“Gold Ball Bond Shear Strength, Effects of Cleaning, Metallization, and Bonding
Parameters,” Proc. 33rd IEEE Electronics Components Conf., Orlando, Florida,
May 16–18, 1983, pp. 208–220.
4-36 Sheaffer, M. and Levine, L., “How to Optimize and Control the Wire Bonding
Process: Part 1,” Solid State Technology, Vol. 33, Nov. 1990, pp. 119–123, and Part
2, Vol. 34, Jan. 1991, pp. 67–70.
4-37 Hu, S. J., Lim, G. E., Lim, T. L., and Foong, K. P., “Study of Temperature
Parameter on the Thermosonic Gold Wire Bonding of High Speed CMOS,”
IEEE Trans. On CHMT, Vol. 14, Dec. 1991, pp. 855–858.
4-38 Chen, Y. S. and Fatemi, H., “Gold Wire Bonding Evaluation By Fractional Factorial
Designed Experiment,” Int. J. Hybrid Microelectronics, Vol. 10, Number 3, 1987,
pp. 1–7.
4-39 Charles, H. K. and Clatterbaugh, G. V., “Ball Bond Shearing - A Complement
to the Wire Bond Pull Test,” Intl. J. Hybrid Microelectronics, Vol. 6, Oct. 1983,
pp. 171–186.
4-40 Basseches, H. and D’Altroy, F., “Shear Mode Wire Failures in Plastic-
Encapsulated Transistors,” IEEE Trans. Components, Hybrids, Manufacturing
Technology, Vol. 1, 1978, pp. 143–147.
4-41 Shell-De Guzman, M., Mahaney, M., and Strode, R., “The In-Process Bond Shear
Test: Its Relationship to Ball Bond Reliability and Its Application to the Reduction of
Wirebond Process Variation,” Microelectronics Reliability, Vol. 33, No. 11/12, 1993,
pp. 1935–1946. Also, see Mahaney, M., Shell, M. K., and Strode, R., “Use of the
In-process Bond Shear Test for Predicting Gold Wirebond Failure Modes in
Plastic Packages,” 29th Proc. IRPS, 1991, pp. 44–51.
4-42 Clarke, R. A. and Lukatela, V., “Inadequacy of Current MIL-STD Wire Bond
Certification Procedures,” Intl J. Microcircuits & Electronic Packaging, Vol. 15,
1992, pp. 87–96.
4-43 Pantaleon R. and Manolo, M., “Rationalization of Gold Ball Bond Shear
Strengths,” Proc. 44th Electronic Components & Technology Conference,
Washington, D.C., May 1–4, 1994, pp. 733–740.
4-44 NBS Special Publication 400-19, Semiconductor Measurement Technology
Quarterly Report, January 1 to June 30, 1975, Bullis, W. M., Ed., April 1976,
p. 51. The NBS portion of the work was done by G. G. Harman and C. A.
Cannon and the Sandia portion by W. Vine.
4-45 Levine, L., “Should We Pull Test and Shear Test Fine-Pitch Wedge and Ribbon
Bonds?” Chip Scale Review, May/June 2003, pp. 13.
4-46 Kim, Y-G., Pavuluri, J. K., White, J. R., B-Vishniac, I. J., and Masada, G. Y.,
“Thermocompression Bonding Effects on Bump-Pad Adhesion,” IEEE Trans
CPMT-Part B, Vol. 18, Feb. 1995, pp. 192–200.
4-47 Charles, H. K.,” Ball Bond Shear Testing: An Interlaboratory Comparison,” Proc.
1986 Intl Symp. for Microelectronics (ISHM) , Atlanta, Georgia, Oct. 6–8, 1986,
pp. 265–274.
4-48 Kumar, S., Florendo, M, Dittmer, K., “A Wire Bond Process Optimization
Strategy for Very Fine Pitch Development,” Proceedings of Assembly Seminar,
Semicon Singapore Conference, Singapore, 1999, pp. 67–75.