Page 18 - Wire Bonding in Microelectronics

Int ro duct ion to T h i rd E d it ion xvii

Manuscript style. The style is that of a technical paper, rather than
the informal style used by the author in his presentations and courses
on this subject. Chemical symbols are used rather than the full element
name for compactness. In general, knowing that aluminum = Al,
copper = Cu, and gold = Au, will take care of the majority of the
usage. However, the Glossary translates most other symbols.
Units. The choice was again (reluctantly) made to use both SI and
English units since parts of the American semiconductor assembly
community still use the latter. However, many figures were
reproduced directly from technical papers and their units may be in
either system alone. Mixed units are still frequently used in English
language publications. The units of force are probably the most
confusing. Grams-force (gf) is most often used in this text. The reader
can convert 1 gf = 9.8 mN (millinewtons). For any remaining
unconverted length units, it should be noted that 1 mil = 0.001 in =
25.4 µm. Some additional conversion factors are included in the text
where appropriate.
Please note: Certain commercial equipment, instruments, or
materials are identified in this book in order to adequately specify an
experimental procedure. Such identification does not imply
recommendation or endorsement by the author(s), nor does it imply
that the materials or equipment identified are necessarily the best
available for the purpose at any given time.