Page 19 - Wire Bonding in Microelectronics

Acknowledgments

his book could not have been written without the editorial
and organiza tional, contributions of Erik Secula. His help is
Timmensely appreciated. I also wish to acknowledge The Semi-
conductor Electronics Division management’s support and dedica-
tion of resources for researching/editing the book.
Various sections of the book have benefited by the technical
reviews and/or contributing comments of William J. Boettinger,
Curt A. Richter, Neil Zimmerman, NIST; Peter Douglas, Custom
Chip Connections; Alfaro Callejas, Gaiser Precision Tools; and Robert
Chylak, Kulicke and Soffa. Direct Contributors: Yong Liu, Fairchild
Semiconductor (Chapter 11); Jamin Ling, Kulicke and Soffa and Luke
England, Fairchild Semiconductor (Chapter 6B); Lee Levine, Process
Solutions Consulting (two appendixes), and Narendra Noolu, Intel
(appendix). Many technical authors have graciously contributed
original copies of their figures (and some animations) incorporated
in this book. Their contributions were essential and acknowledged in
the captions.

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