Page 68 - Wire Bonding in Microelectronics

Ultrasonic Bonding Systems and Technologies 47

2-6 Osterwald, F., Lang, K.-D., and Reichl, H., “Increasing Bond Quality by Ultrasonic
Vibration Monitoring,” Proc. 1996 ISHM/IMC, Denver, CO, pp. 426–431.
2-7 Fritzsche, H., “Improvements in monitoring ultrasonic wire bonding process by
simultaneously monitoring vibration amplitude and bonding friction using lasers
and analytical models,” VTE (Germany) Vol. 3, (2002), pp. 119–126.
2-8 Polytec, Inc. Tustin, California 92780.
2-9 Harman, G. G. and Leedy, K. O., “An Experimental Model of the Microelectronic
Ultrasonic Wire Bonding Mechanism,” 10th Annual Proc. Reliability Physics, Las
Vegas, Nevada, Apr. 5–7, 1972, pp. 49–56.
2-10 Harman, G. G. and Albers, J., “The Ultrasonic Welding Mechanism as Applied
to Aluminum and Gold Wire-Bonding in Microelectronics,” IEEE Trans. on Parts,
Hybrids, and Packaging, Vol. PHP-13, 1977, pp. 406–412.
2-11 NBS Technical Notes in the series Methods of Measurement for Semiconductor
Materials, Process Control and Devices: TN 495 (June 1969); TN 520 (Sept. 1969);
TN 527 (Dec. 1969); TN 571 (Sept. 1970); TN 788 (Mar. 1973); TN 806 (June 1973);
Special Publication 400-4 (Mar. 31, 1974).
2-12 Ji, H., Li, M. C., Wang, J. Guan, and H. S. Bang, “Evolution of the Bond Interface
during Ultrasonic Al–Si Wire Wedge Bonding Process,” Journal of Materials
Processing Technology, Vol. 182, Issues 1–3, 2 Feb. 2007, pp. 202–206.
2-13 Zhou, Y., Li, X., and Noolu, N. J., “A Footprint Study of Bond Initiation in Gold
Wire Crescent Bonding,” IEEE Trans. Packaging Technologies, Vol. 28, Dec. 2005,
pp. 810–816.
2-14 Harman, G. G. and Kessler, H. K., “The Application of Capacitor Microphones
and Magnetic Pickups to the Tuning and Trouble Shooting of Microelectronic
Ultrasonic Bonding Equipment,” NBS TN 573, May 1971, pp. 1–22 (some avail-
ability in 2007).
2-15 Harman, G. G., (Editor/contributor), “Microelectronic Ultrasonic Bonding,” NBS
Special Publication 400-2, Jan. 1974, pp. 1–103, which summarized 5 years of this
work (some availability in 1996).
2-16 McKeown, M. and Voronel, “A. 80 kHz as an Alternate Frequency for Large
Aluminum Wire Bonding,” Proc. IMAPS, San Diego, CA, Oct. 8–12, 2006,
pp. 659–702.
2-17 Takeda, K., Ohmasa, M., Kurosu, N., and Hosaka, J., “Ultrasonic Wirebonding
Using Gold Plated Copper Wire onto Flexible Printed Circuit Board,” Proc. 1994
1MC, Apr. 20–22, 1994, pp. 173–177.
2-18 Chen, G. K. C., “The Roll of Micro-Slip in Ultrasonic Bonding of Microelectronic
Dimensions,”1972 Intl. Microelectronic Symposium (ISHM), Washington, D.C.,
Oct. 30–31 Nov. 1, 1972, pp. 5-A-1-1 to -9, (has 66 early references to bonding and
mechanisms).
2-19 Krazanowski, J. E., “A Transmission Electron Microscopy Study of Ultrasonic Wire
Bonding,” IEEE Trans. CHMT, Vol. 13, Mar. 1990, pp. 176–181.
2-20 Qi, J., Hung, N. C. Li, M., and Liu, D. “Effects of Process Parameters on Bondability
in Ultrasonic Ball Bonding,” Scripta Materialia 54 (2006), pp. 293–297.
2-21 Levine, L., “The Ultrasonic Wedge Bonding Mechanism: Two Theories Converge,”
ISHM 1995 Proceedings, Los Angeles, CA, Oct. 24–26, 1995, pp. 242–246.
2-22 Carrass, A., and Jaecklin, V. P., Analytical Methods to Characterize the Interconnection
Quality of Gold Ball Bonds, Proc. EuPac ‘96, Essen, Germany, Jan. 31–Feb. 2, 1996,
pp. 135–139.
2-23 Langenecker, B., “Effects of Ultrasound on Deformation Characteristics of
Metals,”IEEE Trans. Sonics and Ultrasonics SU-13, 1966, pp. 1–8.
2-24 Coucoulas, A.,“Ultrasonic Welding of Aluminum Leads to Tantalum Thin Films,”
Trans. Metallurgical Soc. of AIME, Vol. 236, 1966, pp. 587–589.
2-25 Pantaleon, R., and Manolo, M., “Rationalization of Gold Ball Bond Shear Strengths,”
44th Electronic Components & Technology Conference, May 1–4, Washington, D.C.,
1994, pp. 733–740.
2-26 Srikanth, N, Murali, S, Wong, YM, and Vath, CJ, “Critical study of thermosonic
copper ball bonding,” Thin Solid Films, Vol. 462, 2004, pp. 339–345.
2-27 Mayer, M., Paul, O., and Baltes, H.,“In-situ Measurement of Stress and Temperature
under Bonding Pads During Wire Bonding Using Integrated Microsensors”, Proc
EMIT ‘98, Bangalore, India, Feb 17–19, 1998, pp. 129–133.