Page 72 - Wire Bonding in Microelectronics

CHAPTER 3

Bonding Wire

Metallurgy and

Characteristics

That Can Affect

Bonding, Reliability,

or Testing

3.1 Introduction
Various parts of this book use materials science and metallurgical
characteristics of bonding wire to explain different bonding pheno-
mena. This chapter includes the stress-strain characteristics, fatigue,
wire hardness, and other properties that affect the results of bond
tests, bondability, and reliability. This chapter also presents wire burn
out, and aging characteristics, as well as a review of the various recent
ASTM standards∗ appropriate to bonding wire in App. 3A. This
chapter also gives actual data on wires and defines the necessary
metallurgical terms in the context of wire bonding. It is recommended
that a reader having no familiarity with metallurgy/materials science
read an introductory text on that subject to better understand the

∗American Society for Testing Materials 100 Barr Harbor Drive, West
Conshohocken, PA 19428.

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