Page 70 - Wire Bonding in Microelectronics

Ultrasonic Bonding Systems and Technologies 49

2-51 Ingle, L., and Koontz, J., “Directly Bonded Interconnect Method and Adaptive
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2-52 Short, R., “Fine Pitch Wedge Bonding for High Density Packaging,” Proc. 1994 Intl.
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2-53 Anderson, 0. L., and Christianson, H., “Technique for Attaching Electrical Leads
to Semiconductors,” J. Appl. Phys., Vol. 28, 1957, pp. 923–924.
2-54 English, A. T., and Hokanson, J. L., “Studies of Bonding Mechanisms and Failure
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2-55 Ahmed, N., and Svitak, J. J., “Characterization of Au-Au Thermocompression
(TC) Bonding,” Proc. Electronic Components Conf, Washington, D.C., May 1975,
pp. 52–63. Also In: Solid State Technology, Vol. 18, Nov. 1975, pp. 25–32.
2-56 Condra, L. W., Svitak, J. J., and Pense, A. W., “The High Temperature Deformation
Properties of Gold and Thermocompression Bonding,” IEEE Trans. on Parts, Hybrids
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2-57 Jellison, J. L., “Kinetics of Thermocompression Bonding to Organic Contaminated
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2-59 Smith, M., “Quality Assurance Issues Associated with Large-Wire Ultrasonic
Bonding,” ASTM Committee F-1.07, Jan. 26, 1995. Also see “Hybrids: Designing for
Maximum Yield in Power, Microwave and RF Devices.” Both available from Orthodyne
Electronics Corp, 2300 Main St., Irvine, California 92714.
2-60 Coucoulas, A., “Hot Work Ultrasonic Bonding? A Method of Facilitating Metal Flow
by Restoration Process,” Proc. 20th IEEE Electronic Components Conf, Washington,
D.C., May 1970, pp. 549–556.
2-61 Kessler, H. K., and Sher, A. H., “Microelectronics Interconnection Bonding with
Ribbon Wire,” NBS Technical Note 767, Apr. 1973, pp. 1–24.
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IEEE Trans. Parts, Hybrids and Packaging, Vol. PHP-11, June 1975, pp. 159–162.
2-63 Beck, D., “The Case for Ribbon Bonding of Large Packages to PCBs,” Surface Mount
Tech., Vol. 8, Apr. 1994, pp. 38–44.
2-64 Terman, F. E., Radio Engineers’ Handbook, McGraw-Hill, New York, 1943,
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2-65 Wong, G., and Oftebro, K., “Bond Test Methodologies for Large Aluminum
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2-66 Knowlson, P. M., “Fundamentals of Parallel Gap Joining,” Microelectronics and
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2-67 Johnson, D. R., and Knutson, R. E., “Parallel Gap Welding to Thick Film
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2-68 Fendrock, J. J., and Hong, L. M., “Parallel Gap Welding to Very Thin Metallization
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2-69 International Technology Roadmap for Semiconductors. International Technology
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2-71 Kromann, G. B., Gerke, R. G., and Huang, W. W., “Hi-Density C4/CBGA
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2-72 Silverberg, G., “Single Point TAB (SPT): Versatile Tool for TAB Bonding,” 1987 Proc.
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for TAB Applications,” Proc. 1993 Intl. Conf on Multichip Modules, Denver, Colorado,
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