Page 303 - An Introduction to Microelectromechanical Systems Engineering

282 Index

TiNi Alloy Company valve, 122–23 Variable optical attenuators (VOAs), 142,
metals, 20 161–65
defined, 122 cross-sectional schematic, 164
fabrication sequence, 123 defined, 161
illustrated, 122 diffraction operation, 163
performance, 123 fabrication, 165
See also Micromachined valves key characteristics, 161
Titanium-nickel alloys, 24 principle of operation, 162
Transition temperature, 23, 24 Voltage-controlled oscillators (VCOs), 192
Transportation Recall Enhancement, Volume manufacturing, 8
Accountability, and Documentation
(TREAD), 6 W
Tunable lasers, 142–51 Wafers
as bench-top test instruments, 142 dicing concerns, 219–20
building blocks illustration, 143 thickness, 219
DFB, 148–51
Wavelength-division multiplexing (WDM),
elements, 143 142
external cavity, 144–48 Wavelength locker, 151–54
metal packaging, 238–39 defined, 151
specifications, 144
elements, 152
tuning operations, 144
etalon, 153
schematic illustration, 153
U Wire bonding, 227–29
Ultraprecision mechanical machining, 64 aluminum, 228
Ultrasonic machining, 68 gold, thermosonic, 228
limitations, 229
V See also Electrical interconnects
Valves. See Micromachined valves
Vanishing dipole, 28 Y
Yaw-rate sensor, 112