Page 299 - An Introduction to Microelectromechanical Systems Engineering

278 Index

Materials (continued) Microelectromechanical switches, 211–14
silicon oxide, 19 Microelectromechanical systems. See MEMS
thermoelectricity, 29–30 Microfluidic interconnects, 231
thin metal films, 20–21 Microfluidics, 169–72
Mean time between failures (MTBF), 247 electroosmotic flow, 171
Mean time to failure (MTTF), 247 electrophoretic flow, 171
Media isolation, 223 mixing in, 171–72
Membrane switch, 212, 213 pumping in, 170–71
MEMS Micromachined valves, 119–28
acceptance, 8–9 applications, 119
analysis and forecast, 5 overview, 119
application areas, 4 from Redwood Microsystems, 120–22
background, xiii sliding plate, 124–26
decision, 7 from TiNi Allow Company, 122–23
defined, 2–3 Micromachining, 3–4
fabrication, xiii advanced process tools, 55–63
fabrication methods, 33–75 basic process flow, 34
in industrial and automotive applications, basic process tools, 34–55
79–129 birth of, 4
life sciences applications, 169–85 bulk, 44
markets, 4–6 commercial process examples, 68–74
market size, xv defined, 3, 33
materials, 13–31 nonlithographic technologies, 63–68
packaging, 217–43 processes for, 33–75
photonic applications, 133–65 silicon, 33
production facilities, 5 Micro/Nano Newsletter, 10
products, 3 Microphonics, 196
reliability, 243–56 Micropumps, 126–28
resources, 9–11 fabrication, 128
RF applications, 189–214 fabrication illustration, 129
solutions, 7 illustrated, 127
standards, 8 pump rate, 128
Metal packaging, 237–40 stand-alone units, 127
benefits, 238 structure, 127
example, 238–39 Microsystems technology (MST), 2
for harsh environments, 240 Micro total analysis system (µTAS), 169
hermetic, 238 Miller indices, 15
TO-type, 237–38 Molded plastic packaging, 240–43
tunable laser, 238–39 approaches, 240–41
See also Packaging characteristics, 240
MicroAssembly cantilever switch, 212 molding process, 241–42
Microcontact printing, 66–67 postmolded, 241
defined, 66 premolded, 242
illustrated, 66 sectional view, 241
process, 66 standards, 243
variations, 66–67 See also Packaging
Microelectrode arrays, 182–85 Molding, 59–60
cell cultures over, 185 MST News, 10
cross section, 183 Multichip modules (MCMs), 233
DNA addressing with, 183–85
fabrication, 183 N
positive biasing, 184 Nanoimprint lithography, 67
Microelectromechanical resonators, 200–211