Page 296 - An Introduction to Microelectromechanical Systems Engineering
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Index                                                                         275

              material properties temperature         Distributed-feedback lasers.
                   dependence, 19                            See DFB tunable laser
              yield strength, 16                      DNA
           Curie temperature, 27                        addressing with microelectrodes, 183–85
                                                        amplification, 174
           D                                            analysis, 172–81
                                                        building blocks, 172
           Daimler Benz angular-rate sensor, 110–12
              defined, 110                              capture probes, 183, 184
              fabrication steps, 111                    complementarity, 174
                                                        electrophoresis on a chip, 176–80
              illustrated, 111
                                                        hybridization arrays, 180–81
              See also Angular-rate sensors
           Damping, 200                                 nucleotides, 172
           Deep reactive ion etching (DRIE), 51, 52–55,  PCR on a chip, 174–76
                                                        polymerase chain reaction (PCR), 173, 174
                   252
                                                        sequencing, 176, 179–80
              ARDE in, 53
              defined, 52                               structure, 173
              etch-rate dependence, 54                Double-sided lithography, 43
                                                      DRIE accelerometers, 103–7
              process characteristics, 52
                                                        angular-rate sensors, 103–7
              silicon fusion bonding with (SFB-DRIE), 71,
                   72                                   defined, 103
              of SOI wafers, 71–72, 73                  gyroscopes, 104–7
                                                        scanning-electron micrograph, 103
              STS tools, 54
              trench profile, 53
              use of, 55                              E
              See also Etching                        EDP etching, 48
           Delamination, 252–53                       EFAB, 62–63
           Delphi Delco angular-rate sensor, 107–9      defined, 62
           Deoxyribonucleic acid. See DNA               example, 63
           DFB tunable laser, 148–51                    process, 62–63
              defined, 148                              process illustration, 63
              fabrication process, 151                Electrical failures, 253–54
              micromirror, 150                        Electrical interconnects, 227–30
              resonant cavity, 149                      flip-chip bonding, 229–30
              schematic, 149                            wire bonding, 227–29
              schematic cross section, 150              See also Interconnects
              See also Tunable lasers                 Electrodischarge machining (EDM), 65
           Diamond, 22                                Electromagnetic interference (EMI), 220
           Die-attach processes, 225–27               Electromechanical etching, 50–51
           Digital Light Processing (DLP), 133, 135     defined, 50
           Digital Mirror Device (DMD), 70, 133,        illustrated, 50
                   135–39                               See also Etching
              defined, 136                            Electroosmotic flow, 171
              environmental tests, 255                Electrophoresis
              fabrication, 137, 138, 219                on a chip, 176–80
              illustrated, 136                          capillary, 177
              micromirror, 255                          defined, 176
              optical beam steering, 137                employing, 178
              package, 223                              fluid injection, 179
              reliability, 139                          gel, 177
              reliability case study, 254–56            illustrated, 177
              structures, 137                           See also DNA
           Digital M × N optical switch, 154–56       Electrophoretic flow, 171
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