Page 295 - An Introduction to Microelectromechanical Systems Engineering
P. 295
274 Index
frequency reference requirement, 204 parasitics, 191
illustrated, 204 quality factor, 190–92
as one-port device, 204 surface-micromachined variable, 192–95
See also Resonators See also Passive components
Beam-steering micromirror, 156–61 Capillary electrophoresis, 177
coils, 159, 160 Carbon monoxide gas sensor, 114–16
defined, 157–58 CVD step, 115
design, 158 defined, 114–15
drive coils, 160 fabrication process, 115
fabrication process, 161 illustrated, 115
gimbal suspension, 159 Ceramic packaging, 233–37
IMMI implementation, 158–59 defined, 235
magnetic actuation, 159 DMD type-A, 237
schematic illustration, 158 fabrication process flow, 236
Bias/adhesion mirror mapping (BAMM), 254 LTCC, 235
Bioinformatics, 182 material properties, 235
Bio-MEMS, 169 of optical MEMS, 236
Bosch sensor, 112–14 shrinkage, 235
defined, 112–13 See also Packaging
fabrication illustration, 114 Chemical-mechanical polishing (CMP), 57,
fabrication process, 113–14 134
illustrated, 112 Chemical-vapor deposition (CVD), 37–40
out-of-phase resonant frequency, 113 atmospheric-pressure (APCVD), 37, 38
sensitivity, 114 in carbon monoxide sensor, 115
See also Sensors defined, 37
Bulk-micromachined variable capacitors, low-pressure (LPCVD), 37, 38, 39, 40
195–97 plasma-enhanced (PECVD), 37, 38, 40
interdigitated-finger, 195–97 of polysilicon, 38
mass movement, 196 of silicon dioxide, 38–39
microphonics and, 196–97 of silicon nitrides, 39–40
See also Capacitors Code-division multiple access (CDMA), 206
Bulk micromachining, 44 Comb-drive resonators, 201–3
defined, 201
C frequency response, 202
illustrated, 202
Calibration and compensation, 224–25 total spring constant, 203
Cantilever switch, 212, 213–14
See also Resonators
contact reliability, 213
cross section, 212 Complementarity, 174
defined, 213 Computer-numerical-controlled (CNC)
machines, 64
gap, 214
Conferences, 10–11
micrograph, 212
See also Switches Coriolis acceleration, 104–5
Capacitive accelerometers, 99–114 Corner compensation, 50
Coupled-resonator bandpass filter, 206–8
ADXL, 101–2
oscillation modes, 207
deep-etched micromachined, 103–7
illustrated, 100 scanning electron micrograph, 206
middle wafer fabrication process, 100 as two-port devices, 208
Cracks, 251
surface micromachined, 10–12 Crash sensors, 3
See also Accelerometers
CRS angular-rate sensor, 109–10
Capacitors, 192–97
bulk-micromachined, 195–97 Crystalline silicon, 14–16
with constant capacitance, 192 crystallographic planes, 14–15
