Page 298 - An Introduction to Microelectromechanical Systems Engineering

Index 277

H Journals, 9–10
Hermetic packaging, 223
High-temperature pressure sensors, 93–94 L
defined, 93 LabChip structure, 180
fabrication process, 94 Laser ablation, 224
silicon-fusion bonding, 94 Laser machining, 64–65
See also Pressure sensors; Sensors defined, 64
Hinges, 88–89 examples, 64
assembly process, 89 process, 64–65
fabrication, 88 Lawrence Livermore National Laboratory
fold-up surface, 88 (LLNL), 175, 176
structures, 89 Lead zirconate titanate (PZT), 29
Hot embossing, 67 LIGA
Hot-wire anemometers, 94 defined, 34
Human 1A Oligo Microarray, 182 “poor man’s,” 60
Lithography, 33, 40–44
I double-sided, 43
large field of view, 43
Imaging/displays, 133–41
nanoimprint, 67
DMD, 135–39
infrared radiation imager, 133–35 projection, 41, 42
Indium-tin-oxide (ITO), 21 proximity, 41
Inductors, 197–200 soft, 66–67
steps, 40
example parameters, 197
thick resist, 42
implementation, 192
parasitics, 191 topographical height variations, 42–43
PARC, 198, 199 Littman-Metcalf external cavity laser, 144–48
planar on-chip, 198 Low-pressure CVD (LPCVD), 37, 38, 39, 40
Low-temperature cofired ceramics, 235
quality factor, 190–92
self-resonance shortcoming, 197 Low-temperature oxide (LTO) passivation
spiral, 198 layers, 223
See also Passive components
Infrared radiation imager, 133–35 M
defined, 134 Magazines, 9–10
fabrication, 134 Magnetic actuation, 84–85
illustrated, 134 Manifold absolute pressure (MAP) sensor, 2
Interconnects, 227–33 Mass flow sensors, 94–96
electrical, 227–30 defined, 94–95
flip-chip bonding, 229–30 illustrated, 95
microfluidic, 231 manufacturing, 95
optical, 232 See also Sensors
Interdigitated-finger capacitor, 195–97 Materials, 13–31
defined, 195 diamond, 22
illustrated, 195 gallium arsenide, 22–23
Ion-beam deposition, 35–36 glass, 21
Isotropic wet etching, 45 piezoelectricity, 26–29
piezoresistivity, 24–26
J polymers, 21, 23
properties, 14
Journal of Micromechanical Systems shape-memory alloys, 23–24
(JMEMS), 9 silicon, 13–19
Journal of Micromechanics and
silicon carbide, 22
Microengineering (JMM), 10
silicon nitride, 19