Page 302 - An Introduction to Microelectromechanical Systems Engineering

Index 281

Sensors Magazine, 10 Spin-on methods, 40
Shape-memory alloys, 23–24 Sputter deposition, 35–36
actuation with, 85 defined, 35
critical temperature and, 23–24 directional randomness, 36
Shocks, 251–52 planar/cylindrical magnetron, 36
Side-shooter nozzles, 87 Stiction, 253
Silicon, 13–19 Stress isolation, 221–22
amorphous, 14, 17–18 SU-8 photosensitive epoxy, 61–62
crystalline, 14–17 defined, 61
defined, 13 structures, 62
interactions, 18 use of, 62
mechanical integrity and, 18 Supercritical drying, 60–61
micromachining, 33 Surface-micromachined variable capacitors,
microstructures, 14 192–97
optical reflectivity, 18 design, 194
polysilicon, 14, 17–18 etch holes, 195
properties, 14 fabrication, 192–93, 194
surface oxidation, 18 implementations, 193
as thermal conductor, 18 in portable applications, 193
Silicon carbide, 22 versions, 193
Silicon dioxide, 38–39 See also Capacitors
Silicon direct bonding, 56–57 Surface micromachining
defined, 56 polysilicon, 69–71
performance, 56 schematic illustration, 70
process, 56–57 systems of materials for, 70
Silicon-fusion bonding, 94 Surface mount technologies (SMT), 217
Silicon fusion bonding with reactive ion Switches, 211–14
etching (SFB-DRIE), 71 cantilever, 212, 213–14
defined, 71 desirable parameters, 211
high aspect ratio, 71 membrane, 212, 213
illustrated, 72 prototypes, 211
Silicon nitride, 19 See also RF MEMS
deposition of, 39–40
LPCVD, 48 T
Silicon-on-sapphire (SOS) wafers, 35 Tape peel test, 253
Silicon oxide, 19
TaqMan tagging, 175, 176
Silk screening. See Screen printing Tetramethyl ammonium hydroxide (TMAH),
Single-crystal reactive etching and 48, 112
metallization (SCREAM) process, Thermal actuation, 84
72–74
Thermal failures, 254
defined, 72 Thermal inkjet heads, 116–19
development, 74
concept, 117
illustrated, 74 fabrication, 117–18
Sliding plate microvalve, 124–26 fabrication illustration, 118
defined, 124 nozzles, 116
designs, 126 Thermal management, 220–21
fabrication, 126 Thermoelectric coolers (TECs), 29
schematic cross section, 125 Thermoelectricity, 29–30
See also Micromachined valves
Thermosonic gold bonding, 228
Small Times Magazine, 10 Thin metal films, 20–21
Soft lithography, 66–67 choice of, 20
Sol-gel process, 58
etching, 44