Page 300 - An Introduction to Microelectromechanical Systems Engineering

Index 279

Nitinol, 24 wafer dicing concerns, 219–20
Nonlithographic technologies, 63–68 wafer/wafer-stack thickness, 219
electrodischarge machining (EDM), 65 PARC inductor, 198, 199
hot embossing, 67 defined, 198
laser machining, 64–65 fabrication process, 199
microcontact printing, 66–67 illustrated, 199
nanoimprint lithography, 67 solenoid process, 198
screen printing, 65–66 Parylenes, 23
soft lithography, 66–67 Passive components, 190–200
ultraprecision mechanical machining, 64 parasitics, 191
ultrasonic machining, 68 quality factors, 190–92
Nozzles, 85–88 Passive micromachined mechanical structures,
defined, 85 85–89
electroforming fabrication, 86–87 fluid nozzles, 85–88
fluid flow paths, 86 hinge mechanisms, 88–89
forming, 85 Peltier effect, 29
parallel orientation, 86 Photoresists, 21
schematic illustrations, 86 positive, 41
side-shooter, 87 spin-on, 40
Photosensitive glass, 62
O Piezoelectric actuation, 84
Piezoelectric coefficients, 29
Optical add/drop multiplexers (OADM), 154 Piezoelectricity, 26–29
Optical beam steering, 137
defined, 27
Optical interconnects, 232–33
gold-plated butterfly package, 232 effect illustrations, 27, 28
hermetic sealing, 232 physical origin, 27
quartz, 29
illustrated, 232
Piezoresistive accelerometers, 98–99
See also Interconnects
Organization, this book, xvii–xviii availability, 98
Orientation-dependent etchants (ODEs), 46 fabrication process, 99
illustrated, 98
Oxidation, 35
See also Accelerometers
Piezoresistivity, 24–26
P
application, 24
Packaging, 217–43 defined, 24
calibration and compensation, 224–25 deformation of energy bands, 25
ceramic, 233–37 p-type, 26
defined, 217 Plasma-enhanced CVD (PECVD), 37, 38, 40
design, 218–25 Plasma etching, 51–52
die-attach processes, 225–27 defined, 51
DMD, 237 DRIE, 51, 52–55
for harsh environments, 240 process, 51
hermetic, 223 RIE, 51–52
media isolation, 223 PMMA, 23
metal, 237–40 Polarized-dependent loss (PDL), 156
molded plastic, 240–43 Polishing, 57, 57–58
process flow, 218 chemical-mechanical (CMP), 134
protective coatings, 222–23 step definition, 57
requirements, 234 Polyimides, 21
solution types, 233–43 defined, 23
stress isolation, 221–22 spin-on, 40
thermal management, 220–21 Polymerase chain reaction (PCR), 173, 174