Page 301 - An Introduction to Microelectromechanical Systems Engineering

280 Index

Polymerase chain reaction (continued) standards, 244–46
on a chip, 174–76 statistical methods in, 246–48
defined, 174 tests, 246
Polymers, 21, 23 See also Failure(s); Quality control
defined, 23 Resonators, 200–211
forms, 21 beam, 203–6
parylenes, 23 comb-drive, 201–3
photoresist, 21 coupled-resonator bandpass filter, 206–8
polyimide, 21, 23 film bulk acoustic, 208–11
Polysilicon, 14, 17–18 microelectromechanical, 200–211
beam structures, 18 See also RF MEMS
deposition of, 38 RF MEMS, 189–214
importance, 17 devices, 189
mechanical properties, 17 losses, 190
piezoresistive effect, 26 low-resistivity metals, 190
surface micromachining, 69–71 microelectromechanical resonators,
Population inversion, 143 200–211
Potassium hydroxide (KOH), 16 microelectromechanical switches, 211–14
etch rate, 47 passive electrical components, 190–200
as KOH, 46 signal integrity, 189–90
Pressure sensors, 89–93 Room-temperature vulcanizing (RTV) rubbers,
fabrication process, 91 227, 252
high-temperature, 93–94
schematic illustration, 90 S
silicon-fusion-bonded, 91 Santur DFB tunable laser, 148–51
See also Sensors
Screen printing, 65–66
Principle axes, 15 defined, 65
Protective coatings, 222–23 illustrated, 65
Psychological barrier, 8–9
process, 65–66
Seebeck effect, 29, 30
Q coefficients, 30
Quality control, 244–46 defined, 29
Quartz thermocouple structure using, 30
crystals, 201 Self-assembled monolayers (SAM), 61
micromachining, 21 coating process, 61
as piezoelectric material, 29 electromagnetic, 82
precursors, 61
R Sensing
capacitive, 82
Reactive ion etching (RIE), 51–52
Redwood Microsystems valve, 120–22 methods, 81–82
defined, 120 objective, 81
piezoresistive, 81–82
fabrication steps, 121
Sensors, 89–116
illustrated, 120
operating mechanism, 121 acceleration, 96–114
See also Micromachined valves angular rate, 104–7
Reliability, 243–56 carbon monoxide gas, 114–16
high-temperature pressure, 93–94
accelerated life modeling, 248–49
bath-tub relationship, 248 mass flow, 94–96
case study, 254–56 pressure, 89–93
protective coatings, 222–23
defined, 246 stress-sensitive, 222
GR-CORE series, 245
Sensors and Actuators (A, B, C), 9
ISO 9000/QS 9000, 244