Page 294 - An Introduction to Microelectromechanical Systems Engineering
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Index
A Angular-rate sensors, 104–7
Accelerated life modeling, 248–49 Daimler Benz, 110–12
Acceleration sensors. See Accelerometers from Delphi Delco Electronics Systems,
Accelerometers, 96–114 107–9
applications, 96 performance, 10
capacitive, 99–114 from Robert Bosch, 112–14
cross-axis sensitivity, 97 from Silicon Sensing Systems, 109–10
piezoresistive, 98–99 specifications, 106
primary specifications, 97 uses, 107
structure, 97 vibrating element, 105
Actuation, 82–85 Anisotropic wet etching, 46–50
electrostatic, 82–84 in convex corners, 49
magnetic, 84–85 etched trench shape, 49
method comparison, 83 illustrated, 49
methods, 82–85 See also Etching
piezoelectric, 84 Anodic bonding, 55–56
protective coatings, 222–23 defined, 55
with shape-memory alloys, 85 illustrated, 55
thermal, 84 process, 55–56
Actuators, 116–19 ANSYS modeling program, 80
comb, 146, 147 Application-specific integrated circuits (ASICs),
complexity, 116 93
thermal, 221 Arrhenius equation, 249, 250
thermal inkjet heads, 116–19 Aspect-ratio-dependent etching (ARDE), 53
Advanced process tools, 55–63 Atmospheric-pressure CVD (APCVD), 37, 38
anodic bonding, 55–56
EFAB, 62–63 B
electroplating, 58–59 Ball grid arrays (BGAs), 235
grinding, 57–58 Basic process tools, 34–55
molding, 59–60 chemical-vapor deposition (CVD), 37–40
photosensitive glass, 62 epitaxy, 34–35
polishing, 57–58 etching, 44–55
self-assembled monolayers, 61 evaporation, 36–37
silicon direct bonding, 56–57 lithography, 40–44
sol-gel deposition methods, 58 oxidation, 35
SU-8 photosensitive epoxy, 61–62 spin-on methods, 40
supercritical drying, 60–61 sputter deposition, 35–36
Amorphous silicon, 14, 17–18 Batch fabrication, 7
defined, 14 Beam resonators, 203–6
piezoresistive effect, 26 compensation scheme, 205
See also Silicon defined, 203
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