Page 118 - Embedded Microprocessor Systems Real World Design
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Supports fast page and ED0 modes
                    Programmable refresh rate
                    Supports two banks of DRAM
                    Programmable row and column address size
                    Supports 256 K x 8 through 4 M x 16 DRAM
                     The  device  pins  used  to  control  the  DRAM  are,  like  most  other  external
                   functions on the chip, shared with the 1/0 ports. If  you use the internal DRAM
                   controller, you must give up Port A on the device. However, the controller handles
                   all functions  of  interfacing  to  the  DRAM,  including  address  multiplexing  and
                   refresh.
                     All  DRAM  controller features are programmed by writing to internal registers.
                  The MC68EZ328 supports about any DRAM you want to use, and even includes a
                   control bit that extends the -RAS  precharge time for slower DRAM devices.
                     Although an onchip DRAM controller greatly simplifies microprocessor circuit
                   design, you still need to keep a few things in mind:
                    Choose a DRAM configuration (size  x word width) that is supported by the CPU.
                    Make sure you can give up the pins needed for the DRAM interface.
                    Be sure the CPU supports the speed/setup  time/modes  of the DRAM you plan
                    to use. This includes features such as the extended -RAS  precharge time of the
                    MC68EZ328.



                   Combination ICs


                  Most microprocessor designs that use external memory require both ROM/PROM
                  and SRAM. Many manufacturers produce ICs that combine both flash ROM and
                  SRAM in a single package. The Toshiba TH50VSF0302 is one such part, combin-
                  ing 1 M x 8 flash with  128K x 8 SRAM. The Toshiba part is designed for 2.7V to
                   3.3V operation, comes in a 48-pin ball grid array (BGA) package, and is available
                  with either a top or bottom boot block (see Chapter 2). The SRAM and flash share
                  a common data and address bus and the device has an access time of 100ns.
                     Toshiba and other manufacturers  make other combination  parts that include
                  bus widths up to 16 bits and memory densities to 2 MB  (flash) and 512K (SRAM).
                  Interfacing these parts to a microprocessor is identical to interfacing other mem-
                  ories. You  must keep in mind that the timing parameters for the RAM and flash
                  memory may not be the same. The Toshiba TH50VSF3680/3681, which has 8MB
                  of  flash and  1MB of  SRAM,  is  a  typical example. The SRAM  in  this part  has a
                  45 ns output enable access time, whereas the flash memory has 40 ns. The address
                  access times on the part are identical, 90ns.
                     The TH50VSF3680/3681 also has a configurable memory configuration feature.
                  Two pins determine the memory size versus bus width:


                   100                                             Embedded Micr@rocessor System
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