Page 412 - Academic Press Encyclopedia of Physical Science and Technology 3rd Chemical Engineering
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 Encyclopedia of Physical Science and Technology  EN009J-427  July 6, 2001  20:25







              Metalorganic Chemical Vapor Deposition                                                      497

              However, in Manasevit’s first paper on MOCVD, concern-  halides (e.g., AsCl 3 ) and Column III metals; (2) VPE using
              ing the epitaxial growth of GaAs on insulators, the actual  Column V hydride sources (e.g., AsH 3 ) and Column III
              epitaxial process was not even mentioned!         trichlorides, e.g., GaCl 3 ; (3) LPE usingColumn III metal
                It is interesting to note that besides MOCVD, many  solutions (e.g., Ga melts with GaAs source material); (4)
              important innovations in III–V compound semiconduc-  MBE using pure elemental sources (e.g., Ga and As). Al-
              tor epitaxial growth technologies were first developed in  ready in 1968, when Manasevit’s paper first appeared, the
              the 1966–1967 time frame. For example, J. J. Tietjen  VPE and LPE technologies were proven for the growth of
              and J. A. Amick (RCA Laboratory, USA) first reported  a variety of III–V “high-performance” devices. By 1973,
              “open-tube” hydride VPE growth of III–Vs in 1966 and  hydride VPE dominated the production of GaAsP light-
              H. Rupprecht et al. (IBM Laboratory, United States) first  emitting diodes (LEDs) and halide VPE dominated the
              reported liquid-phase epitaxial (LPE) growth of ternary  production of high-purity GaAs for electronic devices.
              alloys of Al x Ga 1−x As in 1967. Also in 1967, J. A. Arthur  LPE was the dominant technology for many III–V com-
              (Bell Telephone Laboratories, USA) reported the first  pounds, especially Al-containing devices, including Al-
              studies of the properties of Ga and As molecular beams  GaAs LEDs, lasers, solar cells, and other heterojunction
              in ultrahigh vacuum—which ultimately lead to growth of  devices. By 1975, MBE was being actively researched by a
              GaAsbymolecularbeamepitaxy(MBE)reportedbyA. Y.    few groups, particularly at Bell Laboratories and IBM Re-
              Cho (Bell Telephone Laboratories, USA) in 1970.   search Laboratory. Consequently, there was not much in-
                Over the next few years after 1968, Manasevit and  terest in MOCVD—it was viewed as just “another” III–V
              coworkers explored the growth of various III–V, II–VI,  materials technology—and the materials results seemed
              and IV–VI compounds by MOCVD. Manasevit concen-   to be much worse than those achieved by the other III–V
              tratedonthegrowthofthinsemiconductorfilmsonvarious  epitaxial growth technologies.
              insulating oxide substrates including sapphire, spinel, and  In 1977 R. D. Dupuis et al. reported high-performance
              beryllium oxides. Much of Manasevit’s work was “proof-  AlGaAs/GaAs solar cells and injection lasers grown by
              of-concept” growth studies on insulators. The impurity  MOCVD, showing that this technology could perform
              content of these films was relatively high for several rea-  at levels equal the other III–V materials technologies. In
              sons. First, the purity of the metal alkyl sources was still  1978, they reported the first quantum-well semiconductor
              very far behind that of other precursors used for III–V  injection lasers operating continuously at 300 K, clearly
              epitaxial growth, especially compared to the pure met-  showing that the performance of MOCVD-grown devices
              als and the metal halides. Contributions to the impurity  could, in fact, exceed that of alternate materials technolo-
              concentrations were also made by the hydrides. Further-  gies. These results caused many groups to reconsider the
              more, the MOCVD process is very sensitive to oxygen  exploration of MOCVD materials technology, resulting
              (more so than LPE and VPE) and the quality of the films  in a rapid increase in the rate of publication of research
              is degraded when small oxygen leaks exist in the reactor  papers on this topic and its development as a production
              system. Oxygen incorporation also contributes to exces-  process for III–V epitaxial films.
              sive C incorporation. Given the state-of-the-art in reactor
              system design and construction in the late 1960s and early
                                                                C. General Description of the MOCVD Process
              1970s, this oxygen sensitivity created serious problems,
              especially for the growth of Al-containing alloys. These  The MOCVD process (as applied to the growth of III–V
              combined effects led to low carrier mobilities, high back-  compound semiconductors) generally employs vapor-
              ground impurity concentrations, poor surface morpholo-  phase mixtures of Column III metalorganic and Column V
              gies, and generally low photoluminescence efficiencies  hydride sources (precursors) in a carrier gas and is carried
              compared to those achieved by other competing and more  out in an open-tube process chamber. In some cases, one or
              well-developed III–V materials technologies, e.g., LPE  more of the Column V precursors may also be a metalor-
              and VPE. While Manasevit and other workers studied the  ganic source. The carrier gases are typically purified H 2
              growth of III–Vs by this process in the early and middle  or N 2 . The input gas mixtures are heated above ∼ 350 C
                                                                                                           ◦
              1970s, they were unable to demonstrate materials quality  using a heating system, which provides thermal energy
              comparable to that of other III–V epitaxial technologies  to the growth surface of the substrate. The thermal en-
              such as liquid-phase epitaxy and halogen- and hydride-  ergy source is most often radio-frequency (RF) induction,
              based vapor-phase epitaxy.                        electrical resistance, or optical infrared (IR) heating sys-
                Sincetheearly1960sandintothemiddleandlate1970s,  tems. The process chamber total pressure during growth
              various other III–V materials technologies had been devel-  is typically in the range 20–760 Torr (26–1000 mbar, 2.6–
              oped, and had come to dominate the research and produc-  100 kPa). The process or “reactor” chamber is usually
              tioneffortsworldwide,including(1)VPEusingColumnV  composed of quartz or stainless steel.
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