Page 168 - Handbook of Plastics Technologies
P. 168
THERMOSETS
3.38 CHAPTER 3
TABLE 3.33 Thermal Conductivity of Filled
2
Epoxy Resins, Btu/[(ft -hr-ºF)/ft]
Silver 240
Copper 220
Beryllium oxide 130
Aluminum 110
Steel 40
Solder 25
Aluminum oxide 20
Silver-filled epoxy 4
Aluminum-filled epoxy 2
Aluminum oxide-filled epoxy 1
Unfilled epoxy 0.1
Air 0.015
TABLE 3.34 Electrical Conductivity of Filled
Epoxy Resins, Ω-m
Silver 1.6 × 10 –6
Copper 1.8
Gold 2.3
Aluminum 2.9
Nickel 10.0
Platinum 21.5
Solder 25.0
–3
Silver-filled epoxy 1.0 × 10
Unfilled epoxy 1.0 × 10 15
Polystyrene 1.0 × 10 16
Mica 1.0 × 10 16
trical resistance. Alumina trihydrate increases arc resistance. Microballoons produce
structural foam of high compressive strength.
3.1.4.3.5 Reinforcing Fibers. Reinforcing fibers greatly increase epoxy modulus,
strength, impact strength, heat deflection temperature, and dimensional stability
(Table 3.35).
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