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140                                                                 Pressure Sensors

                 Resonant pressure sensors have been successfully commercialized, and these shall be
                 discussed in detail below to highlight the principles involved.
                    The technical challenges associated with resonant pressure sensors are as
                 follows:


                    • Fabrication of mechanical resonator structure on top of pressure-sensing
                      structure;
                    • In the case of silicon resonators, the incorporation of vibration excitation and
                      detection mechanisms;
                    • The vacuum encapsulation of the resonator to negate gas-damping effects.

                    The earliest MEMS resonant pressure sensor was developed by Greenwood [77]
                 and later commercialized by Druck [78]. A cross-section of the sensor is shown in
                 Figure 6.25 along with a plan view of the resonator and its mode of vibration. The
                 butterfly-shape resonator is attached via four arms to pillars that form part of the
                 diaphragm. As the diaphragm deflects, the angle on the arms causes the resonator to
                 be placed in tension and the resonant frequency to change. The two halves of the
                 resonator are coupled together via a small physical link and the arms are positioned
                 at node points in the optimum mode of operation. The resonator and diaphragm are
                 fabricated using the boron etch stop technique and the resonator driven electrostati-
                 cally and its vibrations detected capacitively via metal electrodes on the support
                 chip. A vacuum is trapped around the resonator by mounting the support chip on a
                 glass stem and sealing the end of the stem while in a vacuum. The assembly is then
                 mounted by the stem, which provides some measure of isolation from packaging
                 stresses (see Chapter 4). The resonator has a Q-factor of 40,000, and the sensor has
                 a resolution of 10 ppm and total error of less than 100 ppm [79].
                    Another successfully commercialized device was developed by the Yokogawa
                 Electric Corporation (DPharp, EJA series differential pressure sensor [80]). This
                 consists of two resonators located on a diaphragm, the differential output of which
                 provides the sensor reading [81]. The resonators are driven electromagnetically by
                 placing the device in a magnetic field and running an alternating current through the
                 structure. The pressure sensor arrangement is shown in Figure 6.26. The fabrication


                                                      Pressure
                                             Diaphragm          Resonator
                                    Glass frit
                                    bond
                                                                       Support
                                                                       chip
                                                     Vacuum


                                                                       Nodes
                         Butterfly
                         resonator
                                                                    Resonant mode



                                         Nodes
                 Figure 6.25  Druck resonant pressure sensor.
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