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6.7 Conclusions 145

6.7 Conclusions

Pressure measurement is certainly one of the most mature applications of MEMS,
and this chapter has described the many types of micromachined sensor that have
been developed, both in industry and academia, over the years. The commercial suc-
cess of this branch of MEMS serves as an excellent model for other potential MEMS
applications. The market pull provided by the automotive industry—for example,
for manifold air pressure sensors—has led to the development of successful devices
and technologies that have benefited a wide range of other pressure sensing applica-
tions. This is made possible by the advantage of batch fabrication micromachining
technologies capable of manufacturing sensors at very low unit cost. The importance
of the material properties of silicon must also not be underestimated. Its inherent pie-
zoresistive behavior facilitates resistive strain gauge pressure sensors, while, at the
other end of the performance spectrum, its mechanical properties make it ideal for
complex resonant-based pressure-sensing solutions. Micromachined pressure
sensors are now an accepted, and in many instances, the preferred option in many
pressure-sensing applications. As MEMS technology advances, fabrication processes
become more capable, and a broader range of materials becomes available,
micromachined pressure sensors will find many new opportunities.

References

[1] Cook, J., “Fundamentals of Sensor Technology: Pressure,” Proc. Sensors Expo., Baltimore,
MD, May 4–6, 1999, pp. 401–415.
[2] Hagen, R., “Choosing the Right Low-Pressure Sensor,” Sensors, September 1998,
http://www.sensorsmag.com.
[3] Di Giovanni, M., Flat and Corrugated Diaphragm Design Handbook, New York: Marcel
Dekker, 1982.
[4] Timoshenko, S., and S. Woinowsky-Krieger, Theory of Plates and Shells, New York:
McGraw-Hill, 1959.
[5] Van Vessem, P., and D. Williams, “Rediscovering the Strain Gauge Pressure Sensor,” Sen-
sors Online, Vol. 16, No. 4, April 1999.
[6] Tufte, O. N., P. W. Chapman, and D. Long, “Silicon Diffused Element Piezoresistive Dia-
phragms,” J. Appli. Phys., Vol. 33, November 1962, pp. 3322–3327.
[7] Sanchez, J. C., “Semi-Conductor Strain Gauge Pressure Sensors,” Instruments and Control
Systems, November 1963, pp. 117–120.
[8] Peake, E. R., A. R. Zias, and J. V. Egan, “Solid-State Digital Pressure Devices,” IEEE
Trans. on Electron Devices, ED-16, No. 19, October 1969, pp. 870–876.
[9] Mallon, J. R., et al., “Low-Pressure Sensors Employing Bossed Diaphragms and Precision
Etch-Stopping,” Sensors and Actuators, Vol. A21–23, 1990, pp. 89–95.
[10] Sandmaier, H., “Non-Linear Analytical Modeling of Bossed Diaphragms for Pressure Sen-
sors,” Sensors and Actuators, Vol. A25–27, 1991, pp. 815–819.
[11] van Mullem, C. J., K. J. Gabriel, and H. Fujita, “Large Deflection Performance of Surface
Micromachined Corrugated Diaphragms,” Proc. Transducers ’91, the 1991 Int. Conf. on
Solid State Sensors and Actuators, San Francisco, CA, June 24–27, 1991, pp. 1014–1017.
[12] Jerman, J. H., “The Fabrication and Use of Micromachined Corrugated Silicon Dia-
phragms,” Sensors and Actuators, Vol. A23, 1990, pp. 988–992.
[13] Timoshenko, S. P., and S. Woinowski-Krieger, Theory of Plates and Shells, New York:
McGraw-Hill, 1983.