Page 159 - MEMS Mechanical Sensors
P. 159

148                                                                 Pressure Sensors

                 [58] Beeby, S. P., M. Stuttle, and N. M. White, “Design and Fabrication of a Low-Cost Microen-
                     gineered Silicon Pressure Sensor with Linearized Output,” IEE Proc. Sci. Meas. Technol.,
                     Vol. 147, No. 3, May 2000, pp. 127–130.
                 [59] Pons, P., G. Blasquez, and R. Behocaray, “Feasibility of Capacitive Pressure Sensors without
                     Compensation Circuits,” Sensors and Actuators, Vol. A37–38, 1993, pp. 112–115.
                 [60] Hyeoncheol, K., Y.-G. Jeong, and K. Chun, “Improvement of the Linearity of Capacitive
                     Pressure Sensor Using an Interdigitated Electrode Structure,” Sensors and Actuators, Vol.
                     A62, 1997, pp. 586–590.
                 [61] Omi, T., et al., “Capacitive Pressure Sensor with Center Clamped Diaphragm,” IEICE
                     Trans. Electron., Vol. E80-C, No. 2, February 1997, pp. 263–268.
                 [62] Park, J. S., and Y. B. Gianchandani, “A Low Cost Batch Sealed Capacitive Pressure Sensor,”
                     IEEE Tech Digest, 12th Intl. Conf. on MEMS, Orlando, FL, January 17–21, 1999,
                     pp. 82–87.
                 [63] Wang, Q., and W. H. Ko, “Modeling of Touch Mode Capacitive Sensors and Diaphragms,”
                     Sensors and Actuators, Vol. A75, 1999, pp. 230–241.
                 [64] Suster, M., D. J. Darrin, and W. H. Ko, “Micro-Power Wireless Transmitter for High Tem-
                     perature MEMS Sensing and Communication Applications,” IEEE Tech Digest 15th Intl.
                     Conf. on MEMS, Las Vegas, NV, January 20–24, 2002, pp. 641–644.
                 [65] Matsumoto, Y., and M. Esasi, “An Integrated Capacitive Absolute Sensor,” Electronics and
                     Communication in Japan, Pt. 2, Vol. 76, No. 1, 1993, pp. 451–461.
                 [66] Kung, J. T., and H.-S., Lee, “An Integrated Air-Gap-Capacitor Pressure Sensor and Digital
                     Readout with Sub-100 Attofarad Resolution,” IEEE J. MEMS, Vol. 1, No. 3, September
                     1992, pp. 121–129.
                 [67] Scheiter, T., et al., “Full Integration of a Pressure Sensor into a Standard BiCMOS Process,”
                     Sensors and Actuators, Vol. A67, 1998, pp. 211–214.
                 [68] Paschen, U., et al., “A Novel Tactile Sensor System for Heavy-Load Applications Based on
                     an Integrated Capacitive Pressure Sensor,” Sensors and Actuators, Vol. A68, 1998,
                     pp. 294–298.
                 [69] Trieu, H. K., N. Kordas, and W. Mokwa, “Fully CMOS Compatible Capacitive Differential
                     Pressure Sensors with On-Chip Programmabilities and Temperature Compensation,” Proc.
                     First IEEE Intl. Conf. on Sensors, Orlando, FL, June 12–14, 2002, Vol. 2, pp. 1451–1455.
                 [70] Dudaicevs, H., et al., “Surface Micromachined Pressure Sensors with Integrated CMOS
                     Read-Out Electronics,” Sensors and Actuators, Vol. A43, Issues 1–3, May 1994,
                     pp. 157–163.
                 [71] Chavan, A. V., and K. D. Wise, “A Monolithic Fully Integrated Vacuum Sealed CMOS Pres-
                     sure Sensor,” IEEE Trans. Electron Devices, Vol. 49, No. 1, January 2002, pp. 164–169.
                 [72] Kandler, M., et al., “A Miniature Single-Chip Pressure and Temperature Sensor,” J. Micro-
                     mech. Microeng., Vol. 2, 1992, pp. 199–201.
                 [73] Hierold, C., et al., “Implantable Low Power Integrated Pressure Sensor System for Minimal
                     Invasive Telemetric Patient Monitoring,” Proc. 11th IEEE Intl. Workshop on MEMS,
                     Heidelberg, Germany, June 25–29, 1998, pp. 568–573.
                 [74] Renard, S., et al., “Miniature Pressure Acquisition Microsystem for Wireless In Vivo
                     Measurements,” Proc. 1st Annual Intl. IEEE-EMBS Special Topic Conf. on Microtechnolo-
                     gies in Medicine and Biology, Lyon, France, October 12–14, 2000, pp. 175–179.
                 [75] Akar, O., T. Akin, and K. Najafi, “A Wireless Batch Sealed Absolute Capacitive Pressure
                     Sensor,” Sensors and Actuators, Vol. A95, 2001, pp. 29–38.
                 [76] deHennis, A., and K. D. Wise, “A Double Sided Single Chip Wireless Pressure Sensor,”
                     IEEE Tech Digest, 15th Intl. Conf. on MEMS, Las Vegas, NV, January 20–24, 2002, pp.
                     252–255.
                 [77] Greenwood, J. C., “Etched Silicon Vibrating Sensor,” J. Phy. E. Sci. Instrum., Vol. 17,
                     1984, pp. 650–652.
                 [78] Druck RPT (Resonant Pressure Transducer) Series Datasheet.
   154   155   156   157   158   159   160   161   162   163   164