Page 260 - MEMS Mechanical Sensors
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9.11 Conclusion                                                               249

                                Out-of-plane bent
                                silicon beam structure                  Bond pads
                                                  Hot-wires









                                                        Polysilicon
                                                        hot-wire
                                 Cured
                                 polyimide
                                                           Metal

                                                         Silicon beam

                  Figure 9.38  Schematic drawing of a triple-hot-wire anemometer. The polysilicon hot-wires are
                               3
                  500 × 5 × 2 µm .(After: [64].)


                  only in the research field but also from industry, which has already commercialized
                  millions of MEMS flow sensors. Examining these in detail, it is noted that, to date,
                  gas flow sensing is more popular than liquid flow sensing. Devices are used for car
                  air intake modules or air-conditioning systems. The BioMEMS field is a promising
                  candidate for further commercializing of microfluidic devices and systems, includ-
                  ing flow sensors working with liquids.
                      CMOS     fabrication  compatibility  is  an  enormous  advantage  for  a
                  micromachined sensor. The fabrication of MEMS devices can run in parallel with
                  other processes in microelectronics fabrication cleanrooms, thereby reducing the
                  costs enormously. This means that metals like platinum or gold, or KOH etching to
                  form thermal isolation structures cannot be used. Specialized MEMS-only clean-
                  rooms would not be economical, as the selling numbers of MEMS sensor chips are
                  still far below microelectronic devices (apart from ink jet printer nozzles and hard
                  disk drive heads). An overview of micromachined thermally based CMOS sensors
                  was presented by Baltes et al. [126].
                      Packaging of a flow sensor is not an easy task. This has a great influence on the
                  sensor’s performance, as described in Chapter 4. For example, the diameter of the
                  channel in which a sensor sits has an impact on the minimum or maximum flow
                  rate. The packaging can protect the sensor from damage by particles, as seen in the
                  aerodynamic bypass developed by Bosch GmbH. Sensors for wall shear stress
                  measurement need to be mounted flush to the wall. Up to now, each sensor needs to
                  have an individual packaging solution, depending on the measurement principle
                  adopted, the required flow range, and the measurement environment.
                      Ultrasonic macroflow measurement systems are commonly used [127]. They
                  are based on drift, Doppler, and attenuation or diffraction effects. Ultrasound is
                  normally generated by piezoelectric transducers. A miniaturized ultrasonic wave
                  velocity and attenuation sensor for liquids was developed in 1993 by Hashimoto et
                  al. [128]. The device is made of silicon and glass with sputtered ZnO to create the
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