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4-10                                                             MEMS: Design and Fabrication



                                                          Starting material:
                                                          blank Si water
                                                          Deposit
                                                          membrane film

                                                          Pattern wafer
                                                          backside


                                                          Etch wafer



                                                          Bond to
                                                          support ring
                   (a)






                                                                 Valve                Mask & substrate
                                                                       Absorber foils
                                         Electron beam



                       Synchrotron radiation





                                                             X-ray scanner





                   (b)

             FIGURE 4.5 (a) Schematic of a typical X-ray mask and (b) mask and substrate assembly in an X-ray scanner. (The
             latter reprinted with permission from IMM [1995] brochure.)



             masks should withstand many exposures without distortion, be alignable with respect to the sample, and
             be rugged. A possible X-ray mask architecture and its assembly with a substrate in an X-ray scanner are
             shown in Figure 4.5. The mask shown here has three major components: an absorber; a membrane, or
             mask blank; and a frame. The absorber contains the information to be imaged onto the resist. It is made
             up of a material with a high atomic number (Z), often Au, patterned onto a membrane material with
             a low Z. The high-Z material absorbs X-rays, whereas the low-Z material transmits X-rays. The frame
             lends robustness to the membrane/absorber assembly so that the whole can be handled confidently.
               The requirements for X-ray masks in LIGA differ substantially from those for the IC industry. A com-
             parison is presented in Table 4.4 [Ehrfeld et al., 1986]. The main difference lies in the absorber thickness.
             To achieve high contrast ( 200), very thick absorbers ( 10 µm vs. 1µm) and highly transparent mask
             blanks (transparency  80%) must be used because of the low resist sensitivity and the great depth of the
             resist. Another difference focuses on the radiation stability of membrane and absorber. For conventional
             optical lithography, the supporting substrate is a relatively thick, optically flat piece of glass or quartz that
                                                                                      6
             is highly transparent to optical wavelengths. It provides a highly stable ( 10 µm) basis for  the thin
             (0.1µm) chrome absorber pattern. In contrast, the X-ray mask consists of a very thin membrane (2 to
             4µm) of low-Z material carrying a high-Z thick absorber pattern [Lawes, 1989]. A single exposure in
             LIGA results in an exposure dose 100 times higher than in the IC case.



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