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             Guckel, H., Skrobis, K.J., Christenson, T.R., Klein, J., Han, S., Choi, B., and Lovell, E.G. (1991a) “Fabrication
                  of Assembled Micromechanical Components via Deep X-ray Lithography,” in Proceedings: IEEE
                  Micro Electro Mechanical Systems (MEMS ’91), January 30th–February 2nd, pp. 74–79, Nara, Japan.
             Guckel, H., Skrobis, K.J., Christenson, T.R., Klein, J., Han, S., Choi, B., Lovell, E.G., and Chapma, T.W.
                  (1991b) “Fabrication and Testing of the Planar Magnetic Micromotor,” J. Micromech. Microeng. 4,
                  pp. 40–45.
             Guckel, H., Uglow, J., Lin, M., Denton, D., Tobin, J., Euch, K., and Juda, M. (1988) “Plasma Polymerization
                  of Methyl  Methacrylate: A  Photoresist  for  3D  Applications,” Technical  Digest:  1988  Solid  State
                  Sensor and Actuator Workshop, Hilton Head Island, SC, pp. 9–12.
             Hagmann, P., and Ehrfeld, W. (1988) “Fabrication of Microstructures of Extreme Structural Heights by
                  Reaction Injection Molding,” J. Polym. Process. Soc. 4, pp. 188–95.
             Hagmann, P., Ehrfeld, W., and  Vollmer, H. (1987)  “Fabrication  of Microstructures  with  Extreme
                  Structural  Heights  by  Reaction  Injection  Molding,” in  First  Meeting  of the  European  Polymer
                  Federation, European Symposium on Polymeric Materials, September, pp. 241–51, Lyon, France.
             Hanemann, T., Ruprecht, R., and  Haubelt, J.H. (1998) “Photomolding  in  Microsystem  Technology,”
                  Polym. Preprints 39, pp. 657–58.
             Harmening, M., Bacher, W., Bley, P., El-Kholi, A., Kalb, H., Kowanz, B., Menz, W., Michel, A., and Mohr, J.
                  (1992) “Molding of Three-Dimensional Microstructures by the LIGA Process,”in Proceedings: IEEE
                  Micro Electro Mechanical Systems (MEMS ’92), Travemunde, Germany, February 4–7, pp. 202–7.
             Harmening, M., Bacher, W., and  Menz, W. (1991)  “Molding  Plateable  Micropatterns  of Electrically
                  Insulating and Electrically Conducting Poly(Methyl Methacrylate)s by the LIGA Technique,” in
                  Makromol. Chem. Macromol. Symp., pp. 277–84.
             Harsch, S., Ehrfeld, W., and Maner, A. (1988) “Untersuchungen zur Herstellung von Mikrostructuren
                  grosser Struktur-hohe durch Galvanoformung in Nickel–sulfamatelek–trolyten,” KfK, Report No.
                  4455, Karlsruhe, Germany.
             Harsch, S., Munchmeyer, D., and  Reinecke, H. (1991)  “A  New  Process  for  Electroforming  Movable
                  Microdevices,” in  Proceedings:  78th  AESF  Annual  Technical  Conference  (SUR/FIN  ’91),
                  Toronto, June.
             Hein, H., Bley, P., Gottert, J., and Klein, U. (1992) “Elektro-nenstrahllithographie zur Herstellung von
                  Rontgen-masken für das LIGA-Verfahren,” Feinw. Tech. Messtech 100, pp. 387–89.
             Henck, R. (1984) “Detecteurs au Silicium Pour Electrons et Rayons X, Principes de Fonctionnement,
                  Fabrication et Performance,” J. Microsc. Spectrosc. Electron. 9, pp. 131–33.
             Hill, R. (1991) “Symposium on X-ray Lithography in Japan,” National Academy of Sciences.
             IMM (1995) “The LIGA Technique,” Commercial Brochure, IMM.
             Jaszewski, R.W., Schift, H., Gobrecht, J., and Smith, P. (1998) “Hot Embossing in Polymers as a Direct Way
                  to Pattern Resist,” Microelectron. Eng. 41/42, pp. 575–78.
             Jaszewski, R.W., Schift, H., Groning, P., and Margaritondo, G. (1997) “Properties of Thin Anti-Adhesive
                  Films Used for the Replication of Microstructures in Polymers,”Microelectron. Eng. 35, pp. 381–84.
             Jaszewski, R.W., Schift, H., Schnyder, B., Schneuwly, A., and Groning, P. (1999) “The Deposition of Anti-
                  Adhesive  Ultra-Thin  Teflon-Like  Films  and  Their  Interaction  with  Polymers  during  Hot
                  Embossing,” Appl. Surf. Sci. 143, pp. 301–8.
             Juang, Y.J., Lee, L.J., and  Koelling, K.W. (2000)  “Viscoplastic  Analysis  of Hot  Embossing  in
                  Microfabrication,” in Proceedings: SPE ANTEC, pp. 1032–36, Orlando.
             Kelly, K.W. (1999) “Molded Microdevice Manufacture for Medical Applications via the LIGA Process,” in
                  Novel  Microfabrication  Options  for  BioMEMS  Conference  (Proceedings), The  Knowledge
                  Foundation, San Francisco.
             Kissler, R.K. (1994)  “µGALV  750,” sales  brochure, R. Kissler, GmbH, Daimlerstrasse  8, Speyer
                  67346.
             Kopp, M.U., Crabtree, H.J., and  Manz, A. (1997) “Developments  in  Technology  and  Applications  in
                  Microsystems,” Curr. Opin. Chem. Biol. 1, 410–19.
             Lawes, R.A. (1989) “Sub-Micron Lithography Techniques,” Appl. Surf. Sci. 36, pp. 485–99.



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