Page 45 -
P. 45
2-26 MEMS: Design and Fabrication
Shibata, T., Kitamoto,Y., Unno, K., and Makino, E. (2000) “Micromachining of Diamond Film for MEMS
Applications,” J. MEMS 9, pp. 47–51.
Shih, C.L., Lai, B.K., Kahn, H., Phillips, S.M., and Heuer, A.H. (2001) “A Robust Co-Sputtering
Fabrication Procedure for TiNi Shape Memory Alloys for MEMS,” J. MEMS 10, pp. 69–79.
Smith, C.S. (1954) “Piezoresistive Effect in Germanium and Silicon,” Phys. Rev. 94, pp. 1–10.
Walker, J.A., Gabriel, K.J., and Mehregany, M. (1991) “Mechanical Integrity of Polysilicon Films Exposed
to Hydrofluoric Acid Solutions,” J. Electron. Mater. 20, pp. 665–70.
Wolfe, S., and Tauber, R. (1999) Silicon Processing for the VLSI Era, 2nd ed., Lattice Press, Sunset Beach,
CA.
Wu, C.H., Zorman, C.A., and Mehregany, M. (1999) “Growth of Polycrystalline SIC Films on SiO and
2
Si N by APCVD,” Thin Solid Films 355–56, pp. 179–83.
3 4
Yang, Y., Wang, X., Ren, C., Xie, J., Lu, P., and Wang, W. (1999) “Diamond Surface Micromachining
Technology,” Diamond Relat. Mater. 8, pp. 1834–37.
Yang, J., Kahn, H., He, A.-Q., Phillips, S.M., and Heuer, A.H. (2000) “A New Technique for Producing
Large-Area As-Deposited Zero-Stress LPCVD Polysilicon Films: The Multipoly Process,” J. MEMS
9, pp. 485–94.
Yasseen, A., Cawley, J.D., and Mehregany, M. (1999) “Thick Glass Film Technology for Polysilicon Surface
Micromachining,” J. MEMS 8, pp. 172–79.
Yasseen, A., Wu, C.H., Zorman, C.A., and Mehregany, M. (2000) “Fabrication and Testing of Surface
Micromachined Polycrystalline SiC Micromotors,” Electron. Device Lett. 21, pp. 164–66.
Zhang, X., Zhang, T.Y., Wong, M., and Zohar, Y. (1998) “Rapid Thermal Annealing of Polysilicon Thin
Films,” J. MEMS 7, pp. 356–64.
Zhang, X., Ghodssi, R., Chen, K.S., Ayon, A.A., and Spearing, S.M. (2000) “Residual Stress
Characterization of Thick PECVD TEOS Film for Power MEMS Applications,” in Technical Digest:
Solid-State Sensor and Actuator Workshop, 4–8 June, Hilton Head, SC, pp. 316–19.
Zorman, C.A., Roy, S., Wu, C.H., Fleischman, A.J., and Mehregany, M. (1996) “Characterization of
Polycrystalline Silicon Carbide Films Grown by Atmospheric Pressure Chemical Vapor Deposition
on Polycrystalline Silicon,” J. Mater. Res. 13, pp. 406–12.
For Further Information
A comprehensive review of polysilicon as a material for microelectronics and MEMS is presented in
Polycrystalline Silicon for Integrated Circuits and Displays, 2nd ed., by Ted Kamins. The Materials Research
Society holds an annual symposium on the materials science of MEMS at its fall meetings. The proceed-
ings from these symposia have been published as volumes 546B, 605B and 657B of the Materials Research
Society Symposium Proceedings. Several regularly published journals contain contributed and review
papers concerning materials aspects of MEMS, including: (1) the Journal of Microelectromechanical
Systems, (2) Journal of Micromachining and Microengineering, (3) Sensors and Actuators, and (4) Sensors
and Materials. These journals are carried by most engineering and science libraries and may be accessible
online.
© 2006 by Taylor & Francis Group, LLC