Page 46 -

3

MEMS Fabrication

3.1 Wet Bulk Micromachining: Introduction ......................3-2
3.2 Historical Note ................................................................3-3
3.3 Silicon Crystallography ..................................................3-5
Introduction • Miller Indices • Crystal Structure of
Silicon • Geometric Relationships among Some Important
Planes in the Silicon Lattice
3.4 Silicon as Substrate ......................................................3-20
3.5 Silicon as a Mechanical Element in MEMS ................3-22
Introduction • Stress–Strain Curve and Elasticity
Constants • Residual Stress in Si • Yield, Tensile Strength,
Hardness, and Creep • Piezoresistivity in Silicon • Bending of
Thin Si Plates • Silicon as a Mechanical MEMS Material:
Summary
3.6 Other Si Sensor Properties ..........................................3-37
Thermal Properties of Silicon • Silicon Optical Properties
• Biocompatibility of Si
3.7 Wet Isotropic and Anisotropic Etching ......................3-40
Introduction • Isotropic Etching • Anisotropic Etching
• Chemical Etching Models
3.8 Etching with Bias and/or Illumination of the
Semiconductor ..............................................................3-72
Introduction • Electropolishing and Microporous Silicon
3.9 Etch-Stop Techniques ..................................................3-80
Introduction • Boron Etch Stop • Electrochemical Etch
Stop • Photo-Assisted Electrochemical Etch Stop (for
n-Type Silicon) • Photo-Induced Preferential Anodization
(for p-Type Silicon) • Etch Stop at Thin Insoluble
Films
3.10 Issues in Wet Bulk Micromachining ............................3-91
Introduction • Extensive Real Estate Consumption • Corner
Compensation
3.11 Computer Simulation Software ................................3-100

3.12 Wet Bulk Micromachining Examples ........................3-101
3.13 Surface Micromachining: Introduction ....................3-109
3.14 Historical Note ............................................................3-111
3.15 Mechanical Properties of Thin Films ........................3-112
Introduction • Adhesion • Stress in Thin Films
• Stress-Measuring Techniques • Strength of
Thin Films

3-1

© 2006 by Taylor & Francis Group, LLC