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MEMS Fabrication                                                                            3-3


             more recently become commercially viable. Atypical structure fashioned in a Si bulk micromachining
             process is shown in Figure 3.1.It was this type of piezoresistive membrane structure, a likely base for a
             pressure sensor, that demonstrated that batch fabrication of miniature components need not be limited
             to  integrated  circuits  (ICs). This  chapter’s  emphasis  is  on  the  wet  etching  process  itself. Two  other
             machining steps typically used in conjunction with wet bulk micromachining, additive processes and
             bonding processes, are covered in Madou (2002).
               After a short historical note on wet bulk micromachining, we will begin with an introduction to the
             crystallography of single-crystal Si and a listing of its properties clarifying the importance of Si as a sen-
             sor material. Some empirical data on wet etching will be reviewed, and different models for anisotropic
             and isotropic etching behavior will follow. Etch stop techniques, which catapulted micromachining into
             an industrial manufacturing process, are then discussed. Subsequently, a discussion of problems associ-
             ated  with  bulk  micromachining, such  as  IC  incompatibility, extensive  real-estate  usage, and  issues
             involving corner compensation, are presented. We conclude with some example applications of wet bulk
             micromachining.


             3.2 Historical Note

             The earliest instance of wet etching of a substrate using a mask (wax) and etchants (acid-base) appears
             in the late 15th or early 16th century for decorating armor [Harris, 1976; Durant, 1957] (Inset 3.1).
             Engraving hand tools were not hard enough to work the armor, and more powerful acid-based processes
             took over. By the early 17th century, etching to decorate arms and armor was a well established process.
             Some pieces stemming from that period have been found in which the chemical milling was accurate to
             within 0.5mm. The masking in traditional chemical milling was accomplished by cutting the maskant with
             a scribing tool and peeling off the maskant where etching was desired. Harris (1976) describes in detail the
             improvements that by the mid-1960s made this type of chemical milling a valuable and reliable method
             of manufacturing especially popular in the aerospace industry. The method enabled manufacturers to
             produce many parts more easily and cheaply than by other means and, in many cases, provided design
             and  production  configurations  not  previously  possible. Through  the  introduction  of photosensitive








































             INSET 3.1 Decorating armor.


             © 2006 by Taylor & Francis Group, LLC
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