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258   •  Chapter 8  /  Failure


                             SEM Micrograph

                            Grain boundaries  Path of crack propagation



























                                 (a)                                             (b)
            Figure 8.7  (a) Schematic cross-section profile showing crack propagation along grain boundaries for intergranular
            fracture. (b) Scanning electron fractograph showing an intergranular fracture surface. 50 .
            [Figure (b) reproduced with permission from ASM Handbook, Vol. 12, Fractography, ASM International, Materials Park, OH, 1987.]



                                Stress Concentration
                                The measured fracture strengths for most materials are significantly lower than those
                                predicted by theoretical calculations based on atomic bonding energies. This discrep-
                                ancy is explained by the presence of microscopic flaws or cracks that always exist under
                                normal conditions at the surface and within the interior of a body of material. These
                                flaws are a detriment to the fracture strength because an applied stress may be amplified
                                or concentrated at the tip, the magnitude of this amplification depending on crack orien-
                                tation and geometry. This phenomenon is demonstrated in Figure 8.8—a stress profile
                                across a cross section containing an internal crack. As indicated by this profile, the mag-
                                nitude of this localized stress decreases with distance away from the crack tip. At posi-
                                tions far removed, the stress is just the nominal stress s 0 , or the applied load divided by
                                the specimen cross-sectional area (perpendicular to this load). Because of their ability to
            stress raiser       amplify an applied stress in their locale, these flaws are sometimes called stress raisers.
                                   If it is assumed that a crack is similar to an elliptical hole through a plate and is ori-
                                ented perpendicular to the applied stress, the maximum stress, s m , occurs at the crack
                                tip and may be approximated by
            For tensile loading,
            computation of                                          a  1/2
            maximum stress at a                           s m = 2s 0 a  b                           (8.1)
            crack tip                                               r t

                                where s 0  is the magnitude of the nominal applied tensile stress, r t  is the radius of curva-
                                ture of the crack tip (Figure 8.8a), and a represents the length of a surface crack, or half
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