Page 134 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim
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114    STANDARD MICROELECTRONIC   TECHNOLOGIES

   gates to define. The newest type of component  is the programmable  analogue  array (PAA)
   device,  and these may well become  increasingly important in sensing applications  in which
   the  design  of  an operational  amplifier circuit  can be  set  and reset through  I/O  ports.
     It  should  be  noted  that  this  classification  of  devices  into  hardware  and  software
   programming is not universally accepted.  Sometimes,  it may be more useful  to distinguish


                                   Standard  devices


                  Standard components          Application-specific ICs




               Fixed      Applications       Semicustom  Full  Silicon
               application  by programming              custom  compilation
          1              1     1    1        i  l  l                 I
        Discrete  Logic  Hardware  Software  Gate  Analogue  Master  Standard
               fam lies  programming  programming  array  array  slice  cell
                      (MASK)
                         1
                n"L     PLA    Microprocessor
                OMOS    ROM   EPROM, EEPROM
                              PLD, PGA, AA

        Figure  4.48  Manufacturing methods  for common  microelectronic  devices and ICs

                                     Increasing
                                       risk




                  Increasing
                   density                                Increasing
                                                          versatility








                Increasing
               time to market                            Increasing
                                                         development
                                                           cost

                                        V
                                     Decreasing
                                      cost/gate

   Figure  4.49  Diagram  showing  the various  trade-offs  between  the different  technologies  adopted
   to make  an ASIC  chip
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