Page 245 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim

REFERENCES 225

devices. The main disadvantage of MSL is that it takes a long time to write into, and
process, a large number of resist layers to fabricate a 3-D component. Although some of
the MSL process technologies address this issue, costs must be reduced to compete with
simpler methods, such as stamping, making 2-D microstructures.

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