Page 270 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim
P. 270

250    MICROSENSORS

     If  we  assume  that  these  microstructures  are  made  of  a  uniform,  homogeneous,  and
   elastic  material,  we can apply a simple  theory  to describe  the way  in which they deform
   when a mechanical  load  is applied, such as a force,  torque,  stress, or pressure.
     For  example,  the  free  end  of  a cantilever beam 14  will  deflect by  a  distance  AJC  when
   a  point  load  F x  is  applied  to  it  (Figure  8.21 (a)).  If  we  ignore  gravitational  forces  and
   assume that there is no residual stress  in the beam,  then the deflection is simply given by
                                          3
                                         /
                                 AJC  =                                 (8.21)
                                       3£ m/ n
   where  E m  is  the  Young's  modulus  of  the  material  and  l m  is the  second  moment  of area
   of  the  beam  and related  to  its  width and  thickness by

                                           3
                                         wd
                                   I m =                                (8.22)

   Equation  (8.21) may be rewritten as,

                                               3E mI n
                          F x  = k m Ax  where k m =                    (8.23)

   where the  constant  of proportionality  k m  is called  the  stiffness  or spring  constant.
     The  simple  cantilever  beam  can  thus  be  used  to  convert  a  mechanical  force  into  a
   displacement.  In a similar  way, a cantilever beam,  bridge,  and diaphragm can be used  to
   measure  not  only  a  point  force  but  also  a  distributed  force,  such  as  stress.  In  addition,
   a  diaphragm  can  be  used  to  measure  a  hydrostatic  or  barometric  pressure.  However, in
   all these  cases, the deflection of the structure has a more complex analytical form,  which
   depends  on  the  precise  nature of the built-in  supports.
     Basic theory assumes that there is no inherent stress in the microstructure itself  because
  that  would  cause  movement  in  the  absence  of  an  applied  load.  However,  the structure
  could  itself  be regarded  as a sensor  for material stress,  and so cantilever beams  are  often
  used  as  test  structures on  silicon  wafers  to  show  that  the  film  deposited  has  no residual
                                                                 rather than the
  stress. In fact, bridges can be used to measure the axial compressive load F y














  Figure  8.21  (a) Deflection of a cantilever  beam  by a vertical point force  F x  and (b) buckling of
  a  beam  by  an  axial compressive  load  F y

  14
    We assume that  the built-in  end  is clamped  on both  sides.
   265   266   267   268   269   270   271   272   273   274   275