Page 7 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim

vi CONTENTS

3.1.2 Atomic Bonding 40
3.1.3 Crystallinity 44
3.2 Metals 49
3.2.1 Physical and Chemical Properties 49
3.2.2 Metallisation 50
3.3 Semiconductors 52
3.3.1 Semiconductors: Electrical and Chemical Properties 52
3.3.2 Semiconductors: Growth and Deposition 54
3.4 Ceramic, Polymeric, and Composite Materials 58
References 59

4 Standard Microelectronic Technologies 61
4.1 Introduction 61
4.2 Wafer Preparation 63
4.2.1 Crystal Growth 63
4.2.2 Wafer Manufacture 66
4.2.3 Epitaxial Deposition 68
4.3 Monolithic Processing 70
4.3.1 Bipolar Processing 73
4.3.2 Characteristics of BJTs 82
4.3.3 MOS Processing 90
4.3.4 Characteristics of FETs 93
4.3.5 SOI CMOS Processing 97
4.4 Monolithic Mounting 99
4.4.1 Die Bonding and Wire Bonding 100
4.4.2 Tape-Automated Bonding 101
4.4.3 Flip TAB Bonding 103
4.4.4 Flip-Chip Mounting 103
4.5 Printed Circuit Board Technologies 104
4.5.1 Solid Board 104
4.5.2 Flexible Board 105
4.5.3 Plastic Moulded 107
4.6 Hybrid and MCM Technologies 108
4.6.1 Thick Film 108
4.6.2 Multichip Modules 108
4.6.3 Ball Grid Array 111
4.7 Programmable Devices And ASICs 112
References 116

5 Silicon Micromachining: Bulk 117
5.1 Introduction 117
5.2 Isotropic and Orientation-Dependent Wet Etching 118
5.3 Etch-Stop Techniques 124
5.3.1 Doping-Selective Etching (DSE) 124
5.3.2 Conventional Bias-Dependent BSE or Electrochemical 126
Etch-Stop