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4.3 NANOPORE STRUCTURE                                                       FUNDAMENTALS
















                  Figure 4.3.7
                  Fibrous composite particles made by a dry processing method [3]. (a) SEM picture of the surface of a fibrous particle;
                  (b) Enlarged picture at the surface of the fibrous particle.


                  (2) Example of production of nanoporous materials  2.0
                  As an example, a porous material can be fabricated
                  by using fumed silica (particle size about 10 nm) as  1.6
                  nanoparticle and glass fiber as fibrous particle
                  (fiber diameter about 10  m, length about 3 mm).  1.2
                  Figure 4.3.7 shows the SEM pictures of the surface
                  of the composite particle made by the dry mechani-  Fracture Strength (MPa)
                  cal method [3].  As seen in the picture, fibrous  0.8
                  composite particles, having highly porous nanoparti-
                  cle layer on the surface of the fiber, can be formed  0.4
                  by applying proper stress conditions that will not
                  break the glass fibers in the particle composing
                  process. Examining the bonded interface between  0.0 300    350      400      450      500
                  the fiber and the nanoparticle with the SEM, it is            Apparent Density (kg/m )
                                                                                               3
                  interesting to find that the particle surface layer has
                  relatively high porous structure, while the fiber sur-  Figure 4.3.8
                  face and the nanoparticles are tightly bonded  Relationship between the fracture strength and apparent
                  together. Making use of this gradient porous struc-  density of a porous component.
                  ture, composite particles having good adhesiveness
                  between the fiber and the nanoparticles, and nano-
                  sized pores can be produced.                   Table 4.3.1
                    Porous material components can be easily made  Relationship between the density, porosity, and thermal
                  by press-forming after filling these composite  conductivity of a porous compact [3].
                  particles into dies. Furthermore, there is no unstable
                  part, which may lead to ripped-off at the surface of                      Thermal conductivity
                  finished components. The relationship between the                         (W/m K)
                  fracture strength and apparent density of the porous  Specimen  Density  Porosity  100 C  400 C
                                                                                              o
                                                                                                          o
                  component is plotted in Fig. 4.3.8 [3]. As seen in the  (kg/m )  (%)
                                                                              3
                  figure, the fracture strength increases with the
                  increase in apparent density; and, it can be up to 1  #1  459    81.2     0.0266    0.0269
                  MPa even at a relative low density, which makes it  #2   485     80.1     0.0266    0.0282
                  possible to process the components without
                  breakage.
                    These nanoporous materials are known to have var-            References
                  ious interesting properties. For example, Table 4.3.1  [1] M. Naito, H. Abe:  Application of Porous Materials in
                  shows the relationship between the density, porosity,
                  and thermal conductivity of a component. The ther-  New Age, CMC Publishing Co. LTD., Japan, pp. 204–209
                  mal conductivity here was measured by periodical  (2004).
                  heating method. As shown in the table, the component  [2] M. Naito, H. Abe: Ceram. Transact., 57, 69–76 (2004).
                  has extremely low thermal conductivity while keeping  [3] H. Abe, I. Abe, K. Sato and M. Naito: J. Am. Ceram.
                  its high porosity.                                Soc., 88, 1359–1361 (2005).

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